El mercado de unión de semiconductores tuvo un valor de 669,48 millones de dólares en 2022 y se estima que crecerá a una tasa compuesta anual del 8,2 % entre 2022 y 2028.
La creciente demanda de productos semiconductores, como chips, del sector automotriz y Se espera que los sectores industriales impulsen el crecimiento del mercado de unión de semiconductores. El mercado automotriz registró un crecimiento del 34,9% en 2021. Además, las comunicaciones inalámbricas, dominadas por los teléfonos inteligentes, tuvieron un crecimiento del 24,6%. Según los datos de Semiconductor Today, el número de teléfonos 5G producidos aumentó de 251 millones de unidades en 2020 a 556 millones en 2021. Además, se prevé que la creciente demanda de dispositivos portátiles, teléfonos inteligentes y servicios 5G impulse el crecimiento del mercado de unión de semiconductores a lo largo del siglo. período de previsión.
Según el informe de la UE, Europa pretende producir la próxima generación de chips de vanguardia (2 nm) para 2030. Las empresas europeas de semiconductores como Infineon Technologies y ASML Holding están invirtiendo fuertemente en investigación y desarrollo para desarrollar soluciones avanzadas de unión de semiconductores. Además, se espera que el creciente número de nuevas empresas europeas en el campo de la unión de semiconductores brinde nuevas oportunidades para las tecnologías digitales en la industria de los semiconductores. Además, se espera que la creciente adopción de vehículos eléctricos en los países europeos, con el apoyo de las iniciativas ecológicas del gobierno, contribuya al crecimiento del mercado de unión de semiconductores. Por ejemplo, el gobierno del Reino Unido ha fijado el objetivo de que todos los vehículos eléctricos para 2030 respalden los estándares de sostenibilidad ambiental.
Mercado de bonos de semiconductores: perspectivas estratégicas
Impacto de la pandemia de COVID-19 en Europa Crecimiento del mercado de unión de semiconductores
El mercado europeo de unión de semiconductores se vio significativamente obstaculizado durante la pandemia de COVID-19 en el segundo trimestre de 2020. Las ventas de semiconductores y vehículos de motor cayeron durante el segundo trimestre de 2020; Este déficit en las ventas fue más que compensado por una mayor necesidad de equipos informáticos y electrónicos debido al cambio hacia las normas de trabajo y aprendizaje remotos. Europa alberga varios fabricantes de automóviles líderes como Mercedes, Volkswagen, Skoda, BMW y Audi. El sector automotriz en Europa se vio gravemente afectado debido a los retrasos en la reapertura de las plantas de ensamblaje por parte de los fabricantes de equipos originales (OEM), la escasez de semiconductores y la reducción de las ventas de vehículos. Por lo tanto, la escasez de chips semiconductores y las interrupciones en el envío obstaculizaron las operaciones de los proveedores de piezas de automóviles y la entrega de equipos de tecnología de semiconductores.
El desarrollo y la producción de componentes de unión de semiconductores en Europa se producen principalmente en Alemania, Francia e Italia. , Países Bajos, Bélgica, Austria e Irlanda. Las empresas europeas suministran productos semiconductores, incluidos chips y obleas, a los sectores de la automoción, la automatización industrial, la seguridad, la atención sanitaria, la aeronáutica, la producción de energía y las telecomunicaciones. Por ejemplo, también se espera que las crecientes iniciativas para el desarrollo de la red 5G en los países europeos impulsen el crecimiento del mercado europeo de unión de semiconductores.
regiones lucrativas para el mercado de unión de semiconductores
Perspectivas del mercado: Mercado de unión de semiconductores
Adopción creciente de tecnología de matrices apiladas en dispositivos IoT
El uso de matrices apiladas mejora significativamente los procesos de diseño de semiconductores. La tecnología de troqueles apilados se utiliza para producir un diseño final de pequeño tamaño. Uno de los principales factores que hace avanzar la técnica de troqueles apilados son los dispositivos electrónicos portátiles. Además, los dispositivos IoT de seguimiento en vivo no están disponibles en tamaños grandes. Al reducir la cantidad de esfuerzo de diseño y aumentar la probabilidad de éxito a la primera, se reduce el tiempo de comercialización. Por lo tanto, la creciente adopción de la tecnología de matrices apiladas en dispositivos IoT está aumentando la demanda de soluciones de unión de semiconductores en el mercado.
Los OEM que operan en el sector de los semiconductores están utilizando los beneficios del IoT más allá de la conectividad. Los sensores, las etiquetas RFID, las balizas inteligentes, los contadores inteligentes y los sistemas de control de distribución son dispositivos y tecnologías de IoT que se utilizan cada vez más en diversas aplicaciones, como la automatización de edificios y del hogar, la logística conectada, la fabricación inteligente, el comercio minorista inteligente, la movilidad inteligente y la movilidad inteligente. transporte. En los dispositivos de IoT, se utilizan técnicas de unión de semiconductores para unir de forma compacta varios troqueles apilados a sustratos, lo que conducirá al crecimiento del mercado de unión de semiconductores.
Información basada en tipos: Mercado de unión de semiconductores
Según el tipo, el mercado se segmenta en unión de matriz, unión de oblea y unión de chip invertido. El segmento de unión de obleas representó la mayor participación del mercado en 2021.
La demanda de unión de obleas es alta debido a la creciente necesidad de una unión y unión estable de dos sustratos en aplicaciones industriales. La unión de obleas es una de las soluciones más rápidas para fabricar múltiples láseres III-V en material de Si en un sistema paralelo. La creciente demanda de dispositivos electrónicos de consumo, como teléfonos inteligentes, dispositivos portátiles inteligentes, iluminación inteligente y otros dispositivos de RF, es uno de los principales factores que genera nuevas oportunidades para los proveedores del mercado de aplicaciones de unión de semiconductores de obleas.
El mercado está segmentado según el tipo, la aplicación y la geografía. Según el tipo, el tamaño del mercado de unión de semiconductores se segmenta en unión de matriz, unión de oblea y unión de chip invertido. Según la aplicación, el análisis del mercado de enlaces de semiconductores se clasifica en dispositivos RF, MEMS y sensores, LED, sensores de imagen CMOS y 3D NAND. Según la geografía, el tamaño del mercado de unión de semiconductores se segmenta principalmente en América del Norte, Europa, Asia Pacífico (APAC), Medio Oriente y Asia. África (MEA) y América del Sur. En 2021, APAC tuvo la mayor participación de mercado de unión de semiconductores y se espera que mantenga su dominio durante el período de pronóstico. También se espera que la región registre la CAGR más alta en el mercado mundial de unión de semiconductores durante el período de pronóstico.
Palomar Technologies; Corporación Panasonic; Toray Industries Inc; Kulicke & Industrias Soffa, Inc.; HUTEM; DIAS Automatización (HK) Ltd; ASMPT Ltd (anteriormente ASM Pacific Technology Ltd.); Grupo EV; Yamaha Motor Corporation (Yamaha Robotics Holdings); y WestBond, Inc. son algunos de los actores clave del mercado de unión de semiconductores.
Los actores del mercado de unión de semiconductores se centran en el desarrollo de sistemas avanzados y eficientes. Por ejemplo:
- En abril de 2021, ASM Pacific Technology introdujo tres nuevos procesos de producción utilizando Transfer Publishing de X-Micro Celeprint y la tecnología de unión de troqueles de buena reproducibilidad de ASM AMICRA para permitir la incorporación diversa de intensidad significativa de materiales ultrafinos. troqueles de oblea de base de hasta 300 mm.
- En septiembre de 2021, Palomar Technologies lanzó un nuevo Palomar 3880-II Die Bonder.
Report Coverage
Revenue forecast, Company Analysis, Industry landscape, Growth factors, and Trends
Segment Covered
This text is related
to segments covered.
Regional Scope
North America, Europe, Asia Pacific, Middle East & Africa, South & Central America
Country Scope
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to country scope.
Frequently Asked Questions
The global semiconductor bonding market was valued at US$ 620.8 Mn in 2021
The key driving factors impacting semiconductor bonding market growth includes:
• Rising Adoption of Stacked Die Technology in IoT Devices
• Growing Number of Product Launches, Partnerships, and Collaborations Related to Semiconductor Bonding Solutions
The key players of semiconductor bonding market are encompassed with Palomar Technologies, Panasonic Corporation, Toray Industries Inc, Kulicke and Soffa Industries, Inc., HUTEM, DIAS Automation (HK) Ltd, ASMPT Ltd (formerly ASM Pacific Technology Ltd.), EV Group, Yamaha Motor Corporation (Yamaha Robotics Holdings), and WestBond, Inc.
APAC is the fastest-growing regional market in the global semiconductor bonding market between 2022-2028.
Canada, France, rest of APAC, South Korea, the UAE, and Brazil are the countries registering high growth rate during the forecast period.
The wafer bonder segment led the global semiconductor bonding market in 2021.
The List of Companies - Semiconductor Bonding Market
- Palomar Technologies
- Panasonic Corporation
- Toray Industries Inc
- Kulicke & Soffa Industries, Inc.
- HUTEM
- DIAS Automation (HK) Ltd
- ASMPT Ltd (formerly ASM Pacific Technology Ltd.)
- EV Group
- Yamaha Motor Corporation (Yamaha Robotics Holdings)
- WestBond, Inc.
The Insight Partners performs research in 4 major stages: Data Collection & Secondary Research, Primary Research, Data Analysis and Data Triangulation & Final Review.
- Data Collection and Secondary Research:
As a market research and consulting firm operating from a decade, we have published and advised several client across the globe. First step for any study will start with an assessment of currently available data and insights from existing reports. Further, historical and current market information is collected from Investor Presentations, Annual Reports, SEC Filings, etc., and other information related to company’s performance and market positioning are gathered from Paid Databases (Factiva, Hoovers, and Reuters) and various other publications available in public domain.
Several associations trade associates, technical forums, institutes, societies and organization are accessed to gain technical as well as market related insights through their publications such as research papers, blogs and press releases related to the studies are referred to get cues about the market. Further, white papers, journals, magazines, and other news articles published in last 3 years are scrutinized and analyzed to understand the current market trends.
- Primary Research:
The primarily interview analysis comprise of data obtained from industry participants interview and answers to survey questions gathered by in-house primary team.
For primary research, interviews are conducted with industry experts/CEOs/Marketing Managers/VPs/Subject Matter Experts from both demand and supply side to get a 360-degree view of the market. The primary team conducts several interviews based on the complexity of the markets to understand the various market trends and dynamics which makes research more credible and precise.
A typical research interview fulfils the following functions:
- Provides first-hand information on the market size, market trends, growth trends, competitive landscape, and outlook
- Validates and strengthens in-house secondary research findings
- Develops the analysis team’s expertise and market understanding
Primary research involves email interactions and telephone interviews for each market, category, segment, and sub-segment across geographies. The participants who typically take part in such a process include, but are not limited to:
- Industry participants: VPs, business development managers, market intelligence managers and national sales managers
- Outside experts: Valuation experts, research analysts and key opinion leaders specializing in the electronics and semiconductor industry.
Below is the breakup of our primary respondents by company, designation, and region:
Once we receive the confirmation from primary research sources or primary respondents, we finalize the base year market estimation and forecast the data as per the macroeconomic and microeconomic factors assessed during data collection.
- Data Analysis:
Once data is validated through both secondary as well as primary respondents, we finalize the market estimations by hypothesis formulation and factor analysis at regional and country level.
- Macro-Economic Factor Analysis:
We analyse macroeconomic indicators such the gross domestic product (GDP), increase in the demand for goods and services across industries, technological advancement, regional economic growth, governmental policies, the influence of COVID-19, PEST analysis, and other aspects. This analysis aids in setting benchmarks for various nations/regions and approximating market splits. Additionally, the general trend of the aforementioned components aid in determining the market's development possibilities.
- Country Level Data:
Various factors that are especially aligned to the country are taken into account to determine the market size for a certain area and country, including the presence of vendors, such as headquarters and offices, the country's GDP, demand patterns, and industry growth. To comprehend the market dynamics for the nation, a number of growth variables, inhibitors, application areas, and current market trends are researched. The aforementioned elements aid in determining the country's overall market's growth potential.
- Company Profile:
The “Table of Contents” is formulated by listing and analyzing more than 25 - 30 companies operating in the market ecosystem across geographies. However, we profile only 10 companies as a standard practice in our syndicate reports. These 10 companies comprise leading, emerging, and regional players. Nonetheless, our analysis is not restricted to the 10 listed companies, we also analyze other companies present in the market to develop a holistic view and understand the prevailing trends. The “Company Profiles” section in the report covers key facts, business description, products & services, financial information, SWOT analysis, and key developments. The financial information presented is extracted from the annual reports and official documents of the publicly listed companies. Upon collecting the information for the sections of respective companies, we verify them via various primary sources and then compile the data in respective company profiles. The company level information helps us in deriving the base number as well as in forecasting the market size.
- Developing Base Number:
Aggregation of sales statistics (2020-2022) and macro-economic factor, and other secondary and primary research insights are utilized to arrive at base number and related market shares for 2022. The data gaps are identified in this step and relevant market data is analyzed, collected from paid primary interviews or databases. On finalizing the base year market size, forecasts are developed on the basis of macro-economic, industry and market growth factors and company level analysis.
- Data Triangulation and Final Review:
The market findings and base year market size calculations are validated from supply as well as demand side. Demand side validations are based on macro-economic factor analysis and benchmarks for respective regions and countries. In case of supply side validations, revenues of major companies are estimated (in case not available) based on industry benchmark, approximate number of employees, product portfolio, and primary interviews revenues are gathered. Further revenue from target product/service segment is assessed to avoid overshooting of market statistics. In case of heavy deviations between supply and demand side values, all thes steps are repeated to achieve synchronization.
We follow an iterative model, wherein we share our research findings with Subject Matter Experts (SME’s) and Key Opinion Leaders (KOLs) until consensus view of the market is not formulated – this model negates any drastic deviation in the opinions of experts. Only validated and universally acceptable research findings are quoted in our reports.
We have important check points that we use to validate our research findings – which we call – data triangulation, where we validate the information, we generate from secondary sources with primary interviews and then we re-validate with our internal data bases and Subject matter experts. This comprehensive model enables us to deliver high quality, reliable data in shortest possible time.
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