High-Speed Connector Market Scope, Size, Share, Trends | 2031

High-Speed Connector Market Size and Forecast (2021 - 2031), Global and Regional Share, Trend, and Growth Opportunity Analysis Report Coverage: By Product (Board-to-Cable, Board-to-Board, and Others), Application (Communication, Automotive, Aerospace and Defense, Energy and Power, Electronics, and Others), and Geography (North America, Europe, Asia Pacific, Middle East & Africa, and South & Central America)

  • Report Code : TIPRE00017912
  • Category : Electronics and Semiconductor
  • Status : Published
  • No. of Pages : 159
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The high-speed connector market size is estimated to grow from US$ 4.25 billion in 2023 to US$ 7.95 billion by 2031; it is projected to grow at a CAGR of 8.2% from 2023 to 2031.

Analyst Perspective:

The report includes growth prospects owing to the current high-speed connector market trends and their foreseeable impact during the forecast period. The market is growing significantly with the increasing importance of high-speed connectivity in the telecommunication sector. Connectivity and communication are crucial for any organization. Businesses need to communicate information comprehensively, quickly, and flexibly to stay competitive in different markets. The continuous demand for electronic and infotainment systems in automobiles is another factor fueling the high-speed connector market.

Market Overview:

High-speed connectors are used in nearly every electronic device across the world. With their versatile range of applications, i.e., from connecting computers to the internet or connecting undersea fiber optic cables to data centers, connectors play a critical role in modern technology-enabled sectors. High-speed connectors often operate only at low voltages and utilize high-quality conductors and data transfer media. Further, the rising deployment of 5G technologies, IoT, and edge computing creates huge opportunities for the high-speed connector market. Various companies are launching new and innovative high-speed connectors. For instance, in May 2022, Carlisle Interconnect Technologies (CarlisleIT), a division of Carlisle Companies (CSL), launched the newest in its signature line of Octax high-speed data connectors—Octax Hybrid. The high-speed connectors market is segmented on the basis of product and application. Based on product, the market is fragmented into board-to-cable, board-to-board, and others. By application, the market is segmented into communications, automotive, aerospace and defense, energy and power, electronics, and others.

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High-Speed Connector Market: Strategic Insights

high-speed-connector-market
Market Size Value inUS$ 4.25 billion in 2023
Market Size Value byUS$ 7.95 billion by 2031
Growth rateCAGR of 8.2% from 2023 to 2031
Forecast Period2023-2031
Base Year2023
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Market Driver:

Increasing Demand for Electronics and Infotainment Systems in Automotive Sector Propels High-Speed Connector Market Growth

Modern infotainment systems equipped with features such as high-resolution displays, navigation, internet connectivity, and advanced audio systems require a high data transfer rate to function precisely. High-speed connectors are specifically designed to transmit data at faster speeds, ensuring a seamless user experience and optimal system performance. The automotive sector is constantly innovating by integrating a wide range of electronic features into vehicles. These features include advanced driver-assistance systems (ADAS), autonomous driving features, and telematics, all of which rely on high-speed data communication between various components. High-speed connectors aid in reliable and efficient data transfer between sensors, cameras, control units, and other electronic systems.

Several companies are investing in the development of infotainment systems enabled by new technologies. In June 2023, Nvidia Corp and MediaTek Inc announced their plan to team up for the development of a technology to power advanced vehicle infotainment systems that would be capable of streaming video or games or using artificial intelligence to interact with drivers. In January 2023, Garmin demonstrated its latest in-cabin solutions for automotive original equipment manufacturers (OEM) at CES 2023, emphasizing on technologies that integrate multiple domains, touchscreens, and wireless devices on a single system-on-chip (SoC). The demonstrated solutions featured four infotainment touchscreens, an instrument cluster, wireless headphones, a cabin monitoring system, smartphones, wireless gaming controllers, and several entertainment options, all powered by a single Garmin multidomain computing module. Therefore, the increasing complexity and data demands of modern automotive electronics and infotainment systems necessitate the use of high-speed connectors, which enable faster data transfer, seamless feature integration, and weight reduction. Thus, the surging demand for electronic and infotainment systems in automobiles propels the high-speed connector market growth.

Segmentation and Scope:

The high-speed connector market analysis has been carried out by considering the following segments: product, application, and geography. Based on product, the market is fragmented into board-to-cable, board-to-board, and others. By application, the market is segmented into communications, automotive, aerospace & defense, energy & power, electronics, and others. The geographic scope of the high-speed connector market report includes North America, Europe, Asia Pacific, the Middle East & Africa, and South & Central America.

  • Sample PDF showcases the content structure and the nature of the information with qualitative and quantitative analysis.

Segmental Analysis:

By application, the market is segmented into communications, automotive, aerospace & defense, energy & power, electronics, and others. The aerospace & defense segment dominated the high-speed connector market share in 2023. Communication has the utmost importance in the aerospace & defense sector as it allows for the seamless integration of systems on planes and systems operated on the ground. They are developed to meet standards such as VITA and VPX protocols to ensure connectivity in critical situations and harsh environments. Advancements in the aerospace industry such as lightweight aircraft, long-range connecting devices, and unmanned aerial vehicles (UAVs) further create the demand for advanced high-speed connectors. These connectors enable the transmission of large volumes of data between various systems in harsh and demanding environments.

electronics-and-semiconductor
Segmental Analysis:
  • Sample PDF showcases the content structure and the nature of the information with qualitative and quantitative analysis.

Regional Analysis:

The North America high-speed connector market is segmented into the US, Canada, and Mexico. The flourishing networking and communications sector, wherein these connectors are highly used to offer enhanced connectivity, reliability, and high-speed transfer, benefits the market in this region. The US dominated the high-speed connector market share in North America in 2023. The increasing demand for faster internet speeds, driven by advancements such as 5G networks and fiber optic broadband, highlights the necessity of high-speed connectors to handle the data flow. In addition, key countries in North America are investing in the expansion and reinforcement of high-speed internet networks. In June 2023, the National Telecommunications and Information Administration (NTIA) of the Department of Commerce announced US$ 930 million to expand middle-mile high-speed internet infrastructure across 35 states and Puerto Rico.

Key Player Analysis:

Samtec, Molex LLC, TE Connectivity, Hirose Electric Co, LTD., Yamaichi, Neoconix, Fujitsu, Omron, IMS Connector Systems, Oupiin Enterprise Co. Ltd, Amphenol are among the key companies profiled in the high-speed connector market report. This report focuses on new product launches, expansion and diversification, and acquisition strategies, which allow them to access prevailing business opportunities.

Recent Developments:

The high-speed connector market forecast can help stakeholders plan their growth strategies. Inorganic and organic strategies, such as mergers and acquisitions, are the major growth strategies adopted by companies in this market. A few recent key market developments, as per company press releases, are listed below:

  • In January 2024, Amphenol Corporation, a prominent global provider of advanced interconnect, antenna, and sensor solutions, announced a definitive agreement to acquire the Carlisle Interconnect Technologies (CIT) business from Carlisle Companies Incorporated (NYSE: CSL) for a cash consideration of US$ 2.025 billion, subject to customary post-closing adjustments. CIT is a leading supplier of rugged interconnect solutions primarily designed for the commercial air, defense, and industrial sectors. It is projected to generate approximately US$ 900 million in sales and has an adjusted Earnings Before Interest, Taxes, Depreciation, and Amortization (EBITDA) margin of ~20% in 2024.
  • In January 2023, Amphenol Communications Solutions launched the PCIe Gen 6 Mini Cool Edge IO GH01 Series of high-speed connectors. Developed in collaboration with the PCI-SIG, these connectors offer exceptional performance in terms of high-speed data transfer and compact design, featuring a 0.6mm pitch. They are designed to meet the stringent requirements of Gen 6 SI performance at 85-ohm impedance. These products find particular relevance in servers, data centers, storage systems, workstations, and networking equipment, enabling the seamless integration of Big Data applications such as artificial intelligence (AI) and machine learning (ML).
  • In September 2021, Amphenol ICC (a global leader in connector technology, design, and manufacturing) collaborated with eTopus Technology (a pioneer in ultra-high-speed ADC/DSP-based SerDes) to develop a groundbreaking 112Gb/s interconnect technology. This innovative solution combines Amphenol ICC's expertise in connector technology with eTopus Technology's advanced SerDes capabilities. The 112Gb/s interconnect technology is designed to meet the demands of high-speed communications, ML, AI, and industrial and instrumentation applications. By utilizing 112Gb/s four-level pulse amplitude modulation (PAM4) technology, these interconnects maximize the bandwidth available in each communication channel.
  • In July 2020, Hirose Electric Co. Ltd. launched the new FX26 series of high-contact, reliable, and durable board-to-board floating connectors with operating temperatures ranging from -40°C to 140°C. This FX26 series won the CES 2020 innovation award (Las Vegas, US) in the Vehicle Intelligence & Transportation category, and the 16th JPCA (i.e., Japan Printed Circuit Association) show award.
  • In February 2019, TE Connectivity launched MULTIGIG RT 3 and MULTIGIG RT 2-S, which are next-generation lightweight, rugged, high-speed backplane connectors to meet the interface dimensions for VITA 46 VPX connectors.
Report Coverage
Report Coverage

Revenue forecast, Company Analysis, Industry landscape, Growth factors, and Trends

Segment Covered
Segment Covered

Product, Application, and Geography

Regional Scope
Regional Scope

North America, Europe, Asia Pacific, Middle East & Africa, South & Central America

Country Scope
Country Scope

This text is related
to country scope.

Frequently Asked Questions


What is the estimated market size for the global high speed connector market in 2023?

The global high speed connector market was estimated to be US$ 4.25 billion in 2023 and is expected to grow at a CAGR of 8.2% during the forecast period 2023 - 2031.

What are the future trends of the global high speed connector market?

Higher speed networking technologies and miniaturization is anticipated to play a significant role in the global high speed connector market in the coming years.

What are the driving factors impacting the global high speed connector market?

The burgeoning importance of telecommunications and increasing demand for electronics and infotainment systems in the automotive sector are the major factors that propel the global high speed connector market.

What will be the market size of the global high speed connector market by 2031?

The global high speed connector market is expected to reach US$ 7.95 billion by 2031.

Which are the key players holding the major market share of the global high speed connector market?

The key players holding majority shares in the global high speed connector market are Samtec Inc; Molex LLC; TE Connectivity Ltd; Hirose Electric Co Ltd; Yamaichi Electronics Co., Ltd.; Neoconix Inc; Fujitsu Ltd; OMRON Corp; IMS Connector Systems GmbH; OUPIIN ENTERPRISE CO., LTD; Amphenol Corp.

What is the incremental growth of the global high speed connector market during the forecast period?

The incremental growth expected to be recorded for the global high speed connector market during the forecast period is US$ 3.70 billion.

The List of Companies - High Speed Connector Market

  1. Samtec Inc
  2. Molex LLC
  3. TE Connectivity Ltd
  4. Hirose Electric Co Ltd
  5. Yamaichi Electronics Co., Ltd.
  6. Neoconix Inc
  7. Fujitsu Ltd
  8. OMRON Corp
  9. IMS Connector Systems GmbH
  10. OUPIIN ENTERPRISE CO., LTD
  11. Amphenol Corp

The Insight Partners performs research in 4 major stages: Data Collection & Secondary Research, Primary Research, Data Analysis and Data Triangulation & Final Review.

  1. Data Collection and Secondary Research:

As a market research and consulting firm operating from a decade, we have published many reports and advised several clients across the globe. First step for any study will start with an assessment of currently available data and insights from existing reports. Further, historical and current market information is collected from Investor Presentations, Annual Reports, SEC Filings, etc., and other information related to company’s performance and market positioning are gathered from Paid Databases (Factiva, Hoovers, and Reuters) and various other publications available in public domain.

Several associations trade associates, technical forums, institutes, societies and organizations are accessed to gain technical as well as market related insights through their publications such as research papers, blogs and press releases related to the studies are referred to get cues about the market. Further, white papers, journals, magazines, and other news articles published in the last 3 years are scrutinized and analyzed to understand the current market trends.

  1. Primary Research:

The primarily interview analysis comprise of data obtained from industry participants interview and answers to survey questions gathered by in-house primary team.

For primary research, interviews are conducted with industry experts/CEOs/Marketing Managers/Sales Managers/VPs/Subject Matter Experts from both demand and supply side to get a 360-degree view of the market. The primary team conducts several interviews based on the complexity of the markets to understand the various market trends and dynamics which makes research more credible and precise.

A typical research interview fulfils the following functions:

  • Provides first-hand information on the market size, market trends, growth trends, competitive landscape, and outlook
  • Validates and strengthens in-house secondary research findings
  • Develops the analysis team’s expertise and market understanding

Primary research involves email interactions and telephone interviews for each market, category, segment, and sub-segment across geographies. The participants who typically take part in such a process include, but are not limited to:

  • Industry participants: VPs, business development managers, market intelligence managers and national sales managers
  • Outside experts: Valuation experts, research analysts and key opinion leaders specializing in the electronics and semiconductor industry.

Below is the breakup of our primary respondents by company, designation, and region:

Research Methodology

Once we receive the confirmation from primary research sources or primary respondents, we finalize the base year market estimation and forecast the data as per the macroeconomic and microeconomic factors assessed during data collection.

  1. Data Analysis:

Once data is validated through both secondary as well as primary respondents, we finalize the market estimations by hypothesis formulation and factor analysis at regional and country level.

  • 3.1 Macro-Economic Factor Analysis:

We analyse macroeconomic indicators such the gross domestic product (GDP), increase in the demand for goods and services across industries, technological advancement, regional economic growth, governmental policies, the influence of COVID-19, PEST analysis, and other aspects. This analysis aids in setting benchmarks for various nations/regions and approximating market splits. Additionally, the general trend of the aforementioned components aid in determining the market's development possibilities.

  • 3.2 Country Level Data:

Various factors that are especially aligned to the country are taken into account to determine the market size for a certain area and country, including the presence of vendors, such as headquarters and offices, the country's GDP, demand patterns, and industry growth. To comprehend the market dynamics for the nation, a number of growth variables, inhibitors, application areas, and current market trends are researched. The aforementioned elements aid in determining the country's overall market's growth potential.

  • 3.3 Company Profile:

The “Table of Contents” is formulated by listing and analyzing more than 25 - 30 companies operating in the market ecosystem across geographies. However, we profile only 10 companies as a standard practice in our syndicate reports. These 10 companies comprise leading, emerging, and regional players. Nonetheless, our analysis is not restricted to the 10 listed companies, we also analyze other companies present in the market to develop a holistic view and understand the prevailing trends. The “Company Profiles” section in the report covers key facts, business description, products & services, financial information, SWOT analysis, and key developments. The financial information presented is extracted from the annual reports and official documents of the publicly listed companies. Upon collecting the information for the sections of respective companies, we verify them via various primary sources and then compile the data in respective company profiles. The company level information helps us in deriving the base number as well as in forecasting the market size.

  • 3.4 Developing Base Number:

Aggregation of sales statistics (2020-2022) and macro-economic factor, and other secondary and primary research insights are utilized to arrive at base number and related market shares for 2022. The data gaps are identified in this step and relevant market data is analyzed, collected from paid primary interviews or databases. On finalizing the base year market size, forecasts are developed on the basis of macro-economic, industry and market growth factors and company level analysis.

  1. Data Triangulation and Final Review:

The market findings and base year market size calculations are validated from supply as well as demand side. Demand side validations are based on macro-economic factor analysis and benchmarks for respective regions and countries. In case of supply side validations, revenues of major companies are estimated (in case not available) based on industry benchmark, approximate number of employees, product portfolio, and primary interviews revenues are gathered. Further revenue from target product/service segment is assessed to avoid overshooting of market statistics. In case of heavy deviations between supply and demand side values, all thes steps are repeated to achieve synchronization.

We follow an iterative model, wherein we share our research findings with Subject Matter Experts (SME’s) and Key Opinion Leaders (KOLs) until consensus view of the market is not formulated – this model negates any drastic deviation in the opinions of experts. Only validated and universally acceptable research findings are quoted in our reports.

We have important check points that we use to validate our research findings – which we call – data triangulation, where we validate the information, we generate from secondary sources with primary interviews and then we re-validate with our internal data bases and Subject matter experts. This comprehensive model enables us to deliver high quality, reliable data in shortest possible time.

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