Solder Paste Market 2028 by Types, Application, Technology, Opportunities, End Users and Regions | The Insight Partners

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Solder Paste Market Forecast to 2028 - Covid-19 Impact and Global Analysis - by Product Type (Rosin Based Pastes, Water Soluble Pastes, No-Clean Pastes); Application (SMT Assembly, Semiconductor Packaging)

Report Code: TIPRE00003593 | No. of Pages: 150 | Category: Chemicals and Materials | Status: Upcoming

MARKET OVERVIEW


Solder paste is basically used in the manufacturing of printed circuit boards (PCB) and is used to connect surface mount components to pads on the board. Solder paste is a mixture of minute solder spheres which are held within a specialized form of solder flux. It is used in the PCB assembly as it provides various advantages, and it enables the process to become simple and easy.


MARKET SCOPE


The “Global Solder Paste Market Analysis to 2028” is a specialized and in-depth study of the chemicals and materials industry with a special focus on global market trend analysis. The report aims to provide an overview of the solder paste market with detailed market segmentation by product type, application, and geography. The report provides key statistics on the market status of the leading solder paste market players and offers key trends and opportunities in the market.

MARKET SEGMENTATION


  • Based on the product type, the global solder paste market is segmented into rosin-based pastes, water soluble paste, and no-clean paste.  
  • Based on application, the global solder paste market is segmented into SMT assembly, semiconductor packaging, consumer electronics, others.  

MARKET DYNAMICS


Drivers-    


  • The increasing demand for solder paste from the electronic manufacturing industry is driving the growth of the solder paste market.  
  • Solder paste is used for printed circuit boards which are used in automotive, marine vehicles, and aerospace industries for electronic functions. Technological advancement in the PCB market, as well as various applications of PCB in various industries, will lead to increase demand for solder paste. 

Restraints-


  • However, the presence of various directives in different countries towards the application of solder paste is restricting the growth of the market.

REGIONAL FRAMEWORK


The report provides a detailed overview of the industry including both qualitative and quantitative information. It provides an overview and forecast of the global market based on various segments. It also provides market size and forecast estimates from the year 2019 to 2028 with respect to five major regions, namely; North America, Europe, Asia-Pacific (APAC), the Middle East and Africa (MEA), and South America. The solder paste market by each region is later sub-segmented by respective countries and segments. The report covers the analysis and forecast of 18 countries globally along with the current trend and opportunities prevailing in the region.
The report analyzes factors affecting the market from both demand and supply side and further evaluates market dynamics affecting the market during the forecast period i.e., drivers, restraints, opportunities, and future trend. The report also provides exhaustive PEST analysis for all five regions namely; North America, Europe, APAC, MEA, and South America after evaluating political, economic, social and technological factors affecting the solder paste market in these regions.


IMPACT OF COVID-19 ON SOLDER PASTE MARKET


COVID-19 first began in Wuhan (China) during December 2019 and since then it has spread at a fast pace across the globe. The US, India, Brazil, Russia, France, the UK, Turkey, Italy, and Spain are some of the worst affected countries in terms of confirmed cases and reported deaths. The COVID-19 has been affecting economies and industries such as the chemical and material industry in various countries due to lockdowns, travel bans, and business shutdowns. Due to the lockdown implemented across various countries, the manufacturing units were closed which had a negative impact on solder paste market. Along with this, the negative impact on the automotive industry due to the disruptions in supply chain of raw materials and key components has led to a fall in demand for PCB which led to a negative impact on the solder paste market. Thus, COVID 19 has had a significant impact on the solder paste market. 


KEY MARKET PLAYERS


The report covers key developments in the solder paste market as organic and inorganic growth strategies. Various companies are focusing on organic growth strategies such as product launches, product approvals and others such as patents and events. Inorganic growth strategies activities witnessed in the market were acquisitions, and partnership & collaborations. These activities have paved way for the expansion of business and customer base of market players. The market players from solder paste market are anticipated to provide lucrative growth opportunities in the future with the rising demand for solder paste in the global market. 
The report also includes the profiles of key companies along with their SWOT analysis and market strategies in the solder paste market. In addition, the report focuses on leading industry players with information such as company profiles, components, and services offered, financial information of the last 3 years, the key development in the past five years.
  • AIM Metals & Alloys LP
  • Henkel Corporation
  • Indium Corporation
  • Inventec
  • Kester
  • KOKI Company Ltd.
  • MacDermid Alpha Electronics Solutions
  • Nihon Superior Co., Ltd.
  • Senju Metal Industry Co., Ltd.
  • TAMURA Corporation
The Insight Partner’s dedicated research and analysis team consist of experienced professionals with advanced statistical expertise and offer various customization options in the existing study.
 
The List of Companies
  1. AIM Metals & Alloys LP
  2. Henkel Corporation
  3. Indium Corporation
  4. Inventec
  5. Kester
  6. KOKI Company Ltd.
  7. MacDermid Alpha Electronics Solutions
  8. Nihon Superior Co., Ltd.
  9. Senju Metal Industry Co., Ltd.
  10. TAMURA Corporation
TIPRE00003593
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