[Research Report] The system in package (SiP) technology market was valued at US$ 13,756.20 million in 2019 and is projected to reach US$ 22,013.45 million by 2027; it is expected to grow at a CAGR of 8.4% from 2020 to 2027.
Electronics devices are getting evolved at rapid rate with integrating more electronic components is circuit boards for advanced features. The devices are getting compact in size with advanced packaging technology to offer enhanced control and space saving for customers. Miniaturization of electronic devices to enhance space in final devices is augmenting the system in package technology market growth. Advent of 5G network connected devices increased demand for system in package technology to integrate 5G supporting components in same space. In addition, growing adoption of smartphones and smart wearables are further supplementing the market growth. Smartphone and smart wearables are getting built using system in package technology to optimize the available space for more components integration.
Increasing adoption of compact electronics gadgets having internet connectivity are supporting the system in package technology to integrate maximum parts in single package. The global system in package (SiP) technology market is segmented in terms of packaging technology, packaging type, interconnection technique, end-use industry and geography. Based on packaging technology, is segmented into 2D IC, 2.5D IC, and 3D IC. In terms of packaging type, the market is segmented into flip-chip/wire-bond SiP, fan-out SiP and embedded SiP. Based on interconnection technique, the market is segmented into small outline, flat packages, pin grid arrays, surface mount, and others. In terms of end-use industry, the market is segmented into automotive, aerospace and defense, consumer electronics, telecommunication, and others. Based on region, the market is segmented into North America, Europe, Asia Pacific (APAC), and rest of the world.
Impact of COVID-19 Pandemic on System in package (SiP) technology Market
Global pandemic situation created by the COVID-19 across the world starting from China hampered the semiconductor industry and economic growth of almost every country. Severe impact on the manufacturing sector is witnessed as facilities remained closed for certain period. Sales of various industrial products such as automotive cars, electronics and others is declined. Office premise, public places, schools, transportation and other spaces also remained closed which declined market growth owing to low sale. The semiconductor industry took major hit as demand for electronics components is lowered from every industrial sector and end consumers, the revenue model for microelectronics has declined as no mass production was carried in the lockdown period. Post lockdown semiconductor industry started to regain the market share as production facilities restarted the operation with taking measure for social distancing. The increasing demand for the small form factor-based electronics devices specifically for health monitoring and smartphones augmented the market growth. For instance, in September, 2020, Apple, a leading brand of smart devices introduced new Apple Watch Series 6 using the S6 System in Package (SiP) and next-generation technologies.
Lucrative Regions in System in package (SiP) technology Market
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System in package (SiP) technology Market Insights
Growing Demand for Miniaturization of Electronic
Electronics gadgets are getting developed using small form factor electronics components to enhance the space and improvise the final product design. Customers are preferring compact, small sized handheld electronic devices offering maximum features. To enhance user experience companies are developing miniaturized electronics to integrate maximum component ins single package. Integrating maximum number component in single package such as sensors, processor and others offers increased features for customers. Rising techno savvy population is one the major factor behind the miniaturization of electronics as it created stiff competition in market players to offer maximum number of features in devices.
Packaging Technology -Based Market Insights
Packaging technology has evolved rapidly to enhance the packaging of small electronics components in single package to optimize the space in final device. 2D IC and 2.5D IC technology offered effective solution for market but had some technological limitations, to overcome a new advanced 3D IC packaging technology is introduced, 3D IC packaging technology further reduced distance to form connection and to assure improved reliability and connectivity. 3D IC packaging technology is gaining strong demand in the market as it offers improved performance comparing to other technologies. In terms of packaging technology, the system in package (SiP) technology market is segmented into 2D IC, 2.5D IC and 3D IC.
System in package (SiP) technology Market, by Packaging Technology – 2019 and 2027
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Packaging Type - Based Market Insights
In terms of packaging type, the market is segmented into flip-chip/wire-bond SiP, fan-out SiP and embedded SiP. Each packaging type have specific benefits as per the application or end product. Flip-chip/wire bod technology offers the short length connection between boards and components. On other hand, fan-out packaging type offers the improved electrical and thermal performance within smaller footprint. Embedded packaging type offers further smaller footprint and high degree of miniaturization. Each technology has its own benefits which are suitable for the various electronics products such as smartphones, smart wearables, car components, PC boards and others.
Interconnection Technique -Based Market Insights
Based on interconnection technique, the market is segmented into small outline, flat packages, pin grid arrays, surface mount, and others. Pin grid arrays is a new emerging technology grabbing more attention of customers owing to benefits offered over other segments. Ceramic, plastic, flip-chip, and staggered arrays are different types of PGAs are available in the market as per the device requirement. The growth of smaller form factor technique to miniaturize electronic devices for automotive and consumer electronics sectors is improved the interconnection technique. Increasing smartphone consumption and wearable devices are propelling the growth of new interconnection techniques.
End-User Industry -Based Market Insights
Based on end-user industry, is segmented into automotive, aerospace & defense, consumer electronics, telecommunications, and others. The demand for compact electronics is surging with new advancement in end users such as smartphones are getting equipped with 5G modules, cars are getting advanced electronics, digital cockpits and others. Smartphones is becoming necessity for population in developed as well as developing nations. In addition, Smart wearables are playing major role in human health monitors. Such development in end user creating demand for small electronics device which supports market growth.
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System in Package (SiP) Technology Market: Strategic Insights
Market Size Value in US$ 13,756.20 Million in 2019 Market Size Value by US$ 22,013.45 Million by 2027 Growth rate CAGR of 8.4% from 2020 to 2027 Forecast Period 2020 - 2027 Base Year 2020
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System in Package (SiP) Technology Market: Strategic Insights
| Market Size Value in | US$ 13,756.20 Million in 2019 |
| Market Size Value by | US$ 22,013.45 Million by 2027 |
| Growth rate | CAGR of 8.4% from 2020 to 2027 |
| Forecast Period | 2020 - 2027 |
| Base Year | 2020 |
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Players operating in the system in package (SiP) technology market focus on strategies, such as market initiatives, acquisitions, and product launches, to maintain their positions in the system in package (SiP) technology market. A few developments by key players of the system in package (SiP) technology market are:
- In 2020, Qualcomm, Chunghwa Telecom, and ASE, jointly developed 5G mmWave enterprise private network smart factory in Taiwan.
- In 2019, Asus launched ASUS ZenFone Max Shot and ZenFone Max Plus (M2) smart phones in Brazil which are powered by Qualcomm’s first Snapdragon System in Package (SiP) chip. Further, the company announced development of Snapdragon SiP Factory in Jaguariúna, Brazil.
System in package (SiP) technology Market – by Packaging Technology
- 2D IC
- 2.5D IC
- 3D IC
System in package (SiP) technology Market – by Packaging Type
- Flip-Chip/Wire-Bond SiP
- Fan-Out SiP
- Embedded SiP
System in package (SiP) technology Market – by Interconnection Technology
- Small Outline
- Flat Packages
- Pin Grid Arrays
- Surface Mount
- Others
System in package (SiP) technology Market – by End-User Industry
- Small Outline
- Flat Packages
- Pin Grid Arrays
- Surface Mount
- Others
System in package (SiP) technology Market – by Geography
North America
- US
- Canada
- Mexico
Europe
- UK
- Germany
- France
- Italy
- Russia
- Rest of Europe
Asia Pacific (APAC)
- China
- Japan
- India
- Australia
- South Korea
- Rest of APAC
Rest of the World
System in package (SiP) technology Market – Company Profiles
- Amkor Technology, Inc.
- ASE Technology Holding Co. Ltd
- ChipMOS TECHNOLOGIES INC
- GS Nanotech
- JCET Group Co., Ltd.
- QUALCOMM INCORPORATED
- Samsung
- Renesas Electronics Corporation
- Texas Instruments Incorporated
- Taiwan Semiconductor Manufacturing Company, Limited
Report Coverage
Revenue forecast, Company Analysis, Industry landscape, Growth factors, and Trends
Segment Covered
Type, Application, End User
Regional Scope
North America, Europe, Asia Pacific, Middle East & Africa, South & Central America
Country Scope
Australia, Canada, China, France, Germany, India, Italy, Japan, MEA, Mexico, Russian Federation, SAM, South Korea, United Kingdom, United States
Frequently Asked Questions
The growth of the browser isolation software market is primarily attributed to growing demand for miniaturization of electronic and rising development in network services- 5G network, thereby substantially driving the system in package (SiP) technology market.
The system in package technology has huge opportunity in the smartphone and PC market to offers advanced processors, transmitters and other components. Technology is improving the device performance as well as offering better space utilization solution. Few market players are developing the processors and other components using the system in packaging technology, while for others its great opportunity to innovate new solution for smartphone and PC processors.
The 2D IC technology has strong roots in the market as it is traditionally being used in a wide range of electronics. It connects different discrete devices using a printed circuit board with their packages. The technology offers large and bulky circuit board, which hinders its performance. A modern electronic components demand small ICs while 2D ICs, which leads to lowered demand for this technology.
1. Introduction
1.1 Scope of the Study
1.2 The Insight Partners Research Report Guidance
1.3 Market Segmentation
1.3.1 Global System in Package (SiP) Technology Market – By Packaging Technology
1.3.2 Global System in Package (SiP) Technology Market – By Packaging Type
1.3.3 Global System in Package (SiP) Technology Market – By Interconnection Technology
1.3.4 Global System in Package (SiP) Technology Market – By End-User Industry
1.3.5 Global System in Package (SiP) Technology Market – By Geography
2. Key Takeaways
3. Research Methodology
3.1 Coverage
3.2 Secondary Research
3.3 Primary Research
4. SiP Technology – Market Landscape
4.1 Market Overview
4.2 PEST Analysis
4.2.1 North America
4.2.2 Europe
4.2.3 Asia-Pacific
4.2.4 Rest of the World
4.3 Ecosystem Analysis
5. SiP Technology –Market Dynamics
5.1 Key Market Drivers
5.1.1 Growing Demand for Miniaturization of Electronic
5.1.2 Rising Development in Network Services- 5G Network
5.2 Key Market Restraints
5.2.1 Technical Issues and Availability Alternative Solution
5.3 Key Market Opportunities
5.3.1 Rising Demand to Enhance Smartphone and PC performance
5.4 Future Trends
5.4.1 Rapid Growth in Wearable technology and the IoT
5.5 Impact Analysis of Drivers and Restraints
6. SiP Technology Market – Global Analysis
6.1 Global System in Package (SiP) Technology Market Overview
6.2 Global System in Package (SiP) Technology Market Revenue Forecast and Analysis
6.3 Market Positioning – Five Key Players
7. SiP Technology Market Analysis – by Packaging Technology
7.1 Overview
7.2 SiP Technology Market Breakdown, by packaging technology, 2017 & 2027
7.3 2D IC
7.3.1 Overview
7.3.2 2D IC Market Forecast and Analysis
7.4 2.5D IC
7.4.1 Overview
7.4.2 2.5D IC Market Forecast and Analysis
7.5 3D IC
7.5.1 Overview
7.5.2 3D IC Market Forecast and Analysis
8. SiP Technology Market Analysis – Packaging Type
8.1 Overview
8.2 Global SiP Technology Market Breakdown, By Packaging Type, 2017 &2027
8.3 Flip-Chip/Wire-Bond SiP Market
8.3.1 Overview
8.3.2 Flip-Chip/Wire-Bond SiP Market Forecast and Analysis
8.4 Fan-Out SiP Market
8.4.1 Overview
8.4.2 Fan-Out SiP Market Forecast and Analysis
8.5 Embedded SiP Market
8.5.1 Overview
8.5.2 Embedded SiP Market Forecast and Analysis
9. SiP Technology Market Analysis – By Interconnection Technique
9.1 Overview
9.2 SiP technology Market Breakdown, By Interconnection Technique, 2017 &2027
9.3 Small Outline
9.3.1 Overview
9.3.2 Small Outline Market Forecast and Analysis
9.4 Flat Packages
9.4.1 Overview
9.4.2 Flat Packages Market Forecast and Analysis
9.5 Pin Grid Arrays
9.5.1 Overview
9.5.2 Pin Grid Arrays Market Forecast and Analysis
9.6 Surface Mount
9.6.1 Overview
9.6.2 Surface Mount Market Forecast and Analysis
9.7 Others
9.7.1 Overview
9.7.2 Others Market Forecast and Analysis
10. SiP Technology Market Analysis – By End-User Industry
10.1 Overview
10.2 SiP technology Market Breakdown, By END-USER INDUSTRY, 2017 &2027
10.3 Automotive
10.3.1 Overview
10.3.2 Automotive Market Forecast and Analysis
10.4 Aerospace & Defense
10.4.1 Overview
10.4.2 Aerospace and Defense Market Forecast and Analysis
10.5 Consumer Electronics
10.5.1 Overview
10.5.2 Consumer Electronics
10.6 Telecommunications
10.6.1 Overview
10.6.2 Telecommunication Market Forecast and Analysis
10.7 Others
10.7.1 Overview
10.7.2 Others Market Forecast and Analysis
11. SiP Technology Market – Geographic Analysis
11.1 Overview
11.2 North America: SiP Technology Market
11.2.1 North America: SiP technology Market – Revenue and Forecast to 2027 (US$ Million)
11.2.2 North America: SiP technology Market, By Country
11.2.3 North America: SiP technology Market, By Packaging Technology
11.2.4 North America: SiP technology Market, By Packaging Type
11.2.5 North America: SiP Technology Market, By Interconnection Technology
11.2.6 North America: SiP Technology Market, By End-user Industry
11.2.7 United States: SiP technology Market – Revenue and Forecast to 2027 (US$ Million)
11.2.7.1 United States System in Package (SiP) Technology Market, by Packaging Technology
11.2.7.2 United States System in Package (SiP) Technology Market, by Packaging Type
11.2.7.3 United States System in Package (SiP) Technology Market, by Interconnection Technology
11.2.7.4 United States System in Package (SiP) Technology Market, by End-user Industry
11.2.8 Canada: SiP technology Market – Revenue and Forecast to 2027 (US$ Million)
11.2.8.1 Canada System in Package (SiP) Technology Market, by Packaging Technology
11.2.8.2 Canada System in Package (SiP) Technology Market, by Packaging Type
11.2.8.3 Canada System in Package (SiP) Technology Market, by Interconnection Technology
11.2.8.4 Canada System in Package (SiP) Technology Market, by End-user
11.2.9 Mexico: SiP technology Market – Revenue and Forecast to 2027 (US$ Million)
11.2.9.1 Mexico System in Package (SiP) Technology Market, by Packaging Technology
11.2.9.2 Mexico System in Package (SiP) Technology Market, by Packaging
11.2.9.3 Mexico System in Package (SiP) Technology Market, by Interconnection Technology
11.2.9.4 Mexico System in Package (SiP) Technology Market, by End-user Industry
11.3 Europe SiP Technology Market Breakdown by Key Countries
11.3.1 Europe: SiP technology Market – Revenue and Forecast to 2027 (US$ Million)
11.3.2 Europe: SiP technology Market, By Country
11.3.3 Europe: SiP Technology Market, By Packaging Technology
11.3.4 Europe: SiP Technology Market, By Packaging Type
11.3.5 Europe: SiP Technology Market, By Interconnection Technology
11.3.6 Europe: SiP Technology Market, By End-user Industry
11.3.7 France SiP Technology System Market Revenue and Forecasts to 2027 (US$ million)
11.3.7.1 France System in Package (SiP) Technology Market, by Packaging Technology
11.3.7.2 France System in Package (SiP) Technology Market, by Packaging Type
11.3.7.3 France System in Package (SiP) Technology Market, by Interconnection Technology
11.3.7.4 France System in Package (SiP) Technology Market, by End-user Industry
11.3.8 Germany SiP Technology Market Revenue and Forecast to 2027 (US$ million)
11.3.8.1 Germany System in Package (SiP) Technology Market, by Packaging Technology
11.3.8.2 Germany System in Package (SiP) Technology Market, by Packaging
11.3.8.3 Germany System in Package (SiP) Technology Market, by Interconnection Technology
11.3.8.4 Germany System in Package (SiP) Technology Market, by End-user Industry
11.3.9 Italy SiP Technology System Market Revenue and Forecasts to 2027 (US$ million)
11.3.9.1 Italy System in Package (SiP) Technology Market, by Packaging Technology
11.3.9.2 Italy System in Package (SiP) Technology Market, by Packaging Type
11.3.9.3 Italy System in Package (SiP) Technology Market, by Interconnection
11.3.9.4 Italy System in Package (SiP) Technology Market, by End-user Industry
11.3.10 United Kingdom: SiP technology Market Revenue and Forecasts to 2027 (US$ million)
11.3.10.1 United Kingdom System in Package (SiP) Technology Market, by Packaging Technology
11.3.10.2 United Kingdom System in Package (SiP) Technology Market, by Packaging Type
11.3.10.3 United Kingdom System in Package (SiP) Technology Market, by Interconnection Technology
11.3.10.4 United Kingdom System in Package (SiP) Technology Market, by End-User Industry
11.3.11 Russia SiP Technology Market Revenue and Forecasts to 2027 (US$ million)
11.3.11.1 Russia System in Package (SiP) Technology Market, by Packaging Technology
11.3.11.2 Russia System in Package (SiP) Technology Market, by Packaging Type
11.3.11.3 Russia System in Package (SiP) Technology Market, by Interconnection Technology
11.3.11.4 Russia System in Package (SiP) Technology Market, by End-User
11.3.12 Rest of Europe SiP Technology Market Revenue and Forecasts to 2027 (US$ million)
11.3.12.1 Rest of Europe System in Package (SiP) Technology Market, by Packaging Technology
11.3.12.2 Rest of Europe System in Package (SiP) Technology Market, by Packaging Type
11.3.12.3 Rest of Europe System in Package (SiP) Technology Market, by Interconnection Technology
11.3.12.4 Rest of Europe System in Package (SiP) Technology Market, by End-user Industry
11.4 Asia Pacific in SiP Technology Market Breakdown by Key Countries
11.4.1 Asia Pacific: SiP technology Market – Revenue and Forecast to 2027 (US$ Million)
11.4.2 Asia Pacific: SiP technology Market, By Country
11.4.3 Asia Pacific: SiP Technology Market, By Packaging Technology
11.4.4 Asia Pacific: SiP Technology Market, By Packaging Type
11.4.5 Asia Pacific: SiP Technology Market, By Interconnection Technology
11.4.6 Asia Pacific: SiP Technology Market, By End-user Industry
11.4.7 China SiP Technology System Market Revenue and Forecasts to 2027 (US$ million)
11.4.7.1 China System in Package (SiP) Technology Market, by Packaging Technology
11.4.7.2 China System in Package (SiP) Technology Market, by Packaging Type
11.4.7.3 China System in Package (SiP) Technology Market, by Interconnection Technology
11.4.7.4 China System in Package (SiP) Technology Market, by End-User Industry
11.4.8 Japan SiP Technology Market Revenue and Forecast to 2027 (US$ million)
11.4.8.1 Japan System in Package (SiP) Technology Market, by Packaging Technology
11.4.8.2 Japan System in Package (SiP) Technology Market, by Packaging
11.4.8.3 Japan System in Package (SiP) Technology Market, by Interconnection Technology
11.4.8.4 Japan System in Package (SiP) Technology Market, by End-user Industry
11.4.9 Australia SiP Technology System Market Revenue and Forecasts to 2027 (US$ million)
11.4.9.1 Australia System in Package (SiP) Technology Market, by Packaging Technology
11.4.9.2 Australia System in Package (SiP) Technology Market, by Packaging Type
11.4.9.3 Australia System in Package (SiP) Technology Market, by Interconnection Technology
11.4.9.4 Australia System in Package (SiP) Technology Market, by End-user Industry
11.4.10 India SiP Technology Market Revenue and Forecasts to 2027 (US$ million)
11.4.10.1 India System in Package (SiP) Technology Market, by Packaging Technology
11.4.10.2 India System in Package (SiP) Technology Market, by Packaging Type
11.4.10.3 India System in Package (SiP) Technology Market, by Interconnection Technology
11.4.10.4 India System in Package (SiP) Technology Market, by End-User Industry
11.4.11 South Korea SiP Technology Market Revenue and Forecasts to 2027 (US$ million)
11.4.11.1 South Korea System in Package (SiP) Technology Market, by Packaging Technogym
11.4.11.2 South Korea System in Package (SiP) Technology Market, by Packaging Type
11.4.11.3 South Korea System in Package (SiP) Technology Market, by Interconnection Technology
11.4.11.4 South Korea System in Package (SiP) Technology Market, by End-user Industry
11.4.12 Rest of Asia Pacific SiP Technology Market Revenue and Forecasts to 2027 (US$ million)
11.4.12.1 Rest of Asia-Pacific System in Package (SiP) Technology Market, by Packaging Technology
11.4.12.2 Rest of Asia-Pacific System in Package (SiP) Technology Market, by Packaging
11.4.12.3 Rest of Asia-Pacific System in Package (SiP) Technology Market, by Interconnection Technology
11.4.12.4 Rest of Asia-Pacific System in Package (SiP) Technology Market, by End-user Industry
11.5 Rest of world SiP Technology Market
11.5.1 Rest of World: System in Package (SiP) Technology Market – Revenue and Forecast to 2027 (US$ Million)
11.5.2 RoW: System in Package (SiP) Technology Market, By Country
11.5.3 RoW: SiP technology Market, By Packaging Technology
11.5.4 RoW: SiP technology Market, By Packaging Type
11.5.5 RoW SiP Technology Market, By Interconnection Technology
11.5.6 RoW: SiP technology Market, By End-user Industry
11.5.7 MEA: System in Package (SiP) Technology Market – Revenue and Forecast to 2027 (US$ Million)
11.5.7.1 MEA System in Package (SiP) Technology Market, by Packaging Technology
11.5.7.2 MEA System in Package (SiP) Technology Market, by Packaging Type
11.5.7.3 MEA System in Package (SiP) Technology Market, by Interconnection Technology
11.5.7.4 MEA System in Package (SiP) Technology Market, by End-user Industry
11.5.8 SAM: System in Package (SiP) Technology Market – Revenue and Forecast to 2027 (US$ Million)
11.5.8.1 SAM System in Package (SiP) Technology Market, by Packaging Technology
11.5.8.2 SAM System in Package (SiP) Technology Market, by Packaging Type
11.5.8.3 SAM System in Package (SiP) Technology Market, by Interconnection Technology
11.5.8.4 SAM System in Package (SiP) Technology Market, by End-user Industry
12. SiP Technology Market - COVID-19 Impact Analysis
12.1 Overview
12.1.1 North America: Impact Assessment of COVID-19 Pandemic
12.1.2 Europe: Impact Assessment of COVID-19 Pandemic
12.1.3 Asia-Pacific: Impact Assessment of COVID-19 Pandemic
12.1.4 Rest of the World: Impact Assessment of COVID-19 Pandemic
13. Industry Landscape
13.1 Overview
13.2 Market Initiative
14. Company Profiles
14.1 Amkor Technology, Inc.
14.1.1 Key Facts
14.1.2 Business Description
14.1.3 Products and Services
14.1.4 Financial Overview
14.1.5 SWOT Analysis
14.1.6 Key Developments
14.2 ASE Technology Holding Co. Ltd
14.2.1 Key Facts
14.2.2 Business Description
14.2.3 Products and Services
14.2.4 Financial Overview
14.2.5 SWOT Analysis
14.2.6 Key Developments
14.3 ChipMOS TECHNOLOGIES INC.
14.3.1 Key Facts
14.3.2 Business Description
14.3.3 Products and Services
14.3.4 Financial Overview
14.3.5 SWOT Analysis
14.3.6 Key Developments
14.4 GS Nanotech
14.4.1 Key Facts
14.4.2 Business Description
14.4.3 Products and Services
14.4.4 Financial Overview
14.4.5 SWOT Analysis
14.4.6 Key Developments
14.5 JCET Group Co., Ltd.
14.5.1 Key Facts
14.5.2 Business Description
14.5.3 Products and Services
14.5.4 SWOT Analysis
14.5.5 Key Developments
14.6 QUALCOMM INCORPORATED
14.6.1 Key Facts
14.6.2 Business Description
14.6.3 Products and Services
14.6.4 Financial Overview
14.6.5 SWOT Analysis
14.6.6 Key Developments
14.7 Samsung
14.7.1 Key Facts
14.7.2 Business Description
14.7.3 Products and Services
14.7.4 Financial Overview
14.7.5 SWOT Analysis
14.7.6 Key Developments
14.8 Renesas Electronics Corporation
14.8.1 Key Facts
14.8.2 Business Description
14.8.3 Products and Services
14.8.4 Financial Overview
14.8.5 SWOT Analysis
14.8.6 Key Developments
14.9 Texas Instruments Incorporated
14.9.1 Key Facts
14.9.2 Business Description
14.9.3 Products and Services
14.9.4 Financial Overview
14.9.5 SWOT Analysis
14.9.6 Key Developments
14.10 Taiwan Semiconductor Manufacturing Company, Limited
14.10.1 Key Facts
14.10.2 Business Description
14.10.3 Products and Services
14.10.4 Financial Overview
14.10.5 SWOT Analysis
14.10.6 Key Developments
15. Appendix
15.1 About The Insight Partners
15.2 Glossary of Terms
LIST OF TABLES
Table 1. Global System in Package (SiP) Technology Market Revenue and Forecasts to 2027 (US$ Million)
Table 2. United States System in Package (SiP) Technology Market, by Packaging Technology – Revenue and Forecast to 2027 (USD Million)
Table 3. United States System in Package (SiP) Technology Market, by Packaging Type – Revenue and Forecast to 2027 (USD Million)
Table 4. United States System in Package (SiP) Technology Market, by Interconnection Technology – Revenue and Forecast to 2027 (USD Million)
Table 5. United States System in Package (SiP) Technology Market, by End-user Industry – Revenue and Forecast to 2027 (USD Million)
Table 6. Canada System in Package (SiP) Technology Market, by Packaging Type – Revenue and Forecast to 2027 (USD Million)
Table 7. Canada System in Package (SiP) Technology Market, by Packaging Type – Revenue and Forecast to 2027 (USD Million)
Table 8. Canada System in Package (SiP) Technology Market, by Interconnection Technology – Revenue and Forecast to 2027 (USD Million)
Table 9. Canada System in Package (SiP) Technology Market, by End-user Industry – Revenue and Forecast to 2027 (USD Million)
Table 10. Mexico System in Package (SiP) Technology Market, by Packaging Technology – Revenue and Forecast to 2027 (USD Million)
Table 11. Mexico System in Package (SiP) Technology Market, by Packaging Type – Revenue and Forecast to 2027 (USD Million)
Table 12. Mexico System in Package (SiP) Technology Market, by Interconnection Technology – Revenue and Forecast to 2027 (USD Million)
Table 13. Mexico System in Package (SiP) Technology Market, by End-user Industry – Revenue and Forecast to 2027 (USD Million)
Table 14. France System in Package (SiP) Technology Market, by Packaging Technology – Revenue and Forecast to 2027 (USD Million)
Table 15. France System in Package (SiP) Technology Market, by Packaging Type – Revenue and Forecast to 2027 (USD Million)
Table 16. France System in Package (SiP) Technology Market, by Interconnection Technology – Revenue and Forecast to 2027 (USD Million)
Table 17. France System in Package (SiP) Technology Market, by End-user Industry – Revenue and Forecast to 2027 (USD Million)
Table 18. Germany System in Package (SiP) Technology Market, by Packaging Technology – Revenue and Forecast to 2027 (USD Million)
Table 19. Germany System in Package (SiP) Technology Market, by Packaging Type – Revenue and Forecast to 2027 (USD Million)
Table 20. Germany System in Package (SiP) Technology Market, by Interconnection Technology – Revenue and Forecast to 2027 (USD Million)
Table 21. Germany System in Package (SiP) Technology Market, by End-user Industry – Revenue and Forecast to 2027 (USD Million)
Table 22. Italy System in Package (SiP) Technology Market, by Packaging Technology – Revenue and Forecast to 2027 (USD Million)
Table 23. Italy System in Package (SiP) Technology Market, by Packaging Type – Revenue and Forecast to 2027 (USD Million)
Table 24. Italy System in Package (SiP) Technology Market, by Interconnection Technology – Revenue and Forecast to 2027 (USD Million)
Table 25. Italy System in Package (SiP) Technology Market, by End-user Industry – Revenue and Forecast to 2027 (USD Million)
Table 26. United Kingdom System in Package (SiP) Technology Market, by Packaging Technology – Revenue and Forecast to 2027 (USD Million)
Table 27. United Kingdom System in Package (SiP) Technology Market, by Packaging Type – Revenue and Forecast to 2027 (USD Million)
Table 28. United Kingdom System in Package (SiP) Technology Market, by Interconnection Technology – Revenue and Forecast to 2027 (USD Million)
Table 29. United Kingdom System in Package (SiP) Technology Market, by End-User Industry – Revenue and Forecast to 2027 (USD Million)
Table 30. Russia System in Package (SiP) Technology Market, by Packaging Technology – Revenue and Forecast to 2027 (USD Million)
Table 31. Russia System in Package (SiP) Technology Market, by Packaging Type – Revenue and Forecast to 2027 (USD Million)
Table 32. Russia System in Package (SiP) Technology Market, by Interconnection Technology – Revenue and Forecast to 2027 (USD Million)
Table 33. Russia System in Package (SiP) Technology Market, by End-User Industry – Revenue and Forecast to 2027 (USD Million)
Table 34. Rest of Europe System in Package (SiP) Technology Market, by Packaging Technology – Revenue and Forecast to 2027 (USD Million)
Table 35. Rest of Europe System in Package (SiP) Technology Market, by Packaging Type – Revenue and Forecast to 2027 (USD Million)
Table 36. Rest of Europe System in Package (SiP) Technology Market, by Interconnection Technology – Revenue and Forecast to 2027 (USD Million)
Table 37. Rest of Europe System in Package (SiP) Technology Market, by End-user Industry – Revenue and Forecast to 2027 (USD Million)
Table 38. China System in Package (SiP) Technology Market, by Packaging Technology – Revenue and Forecast to 2027 (USD Million)
Table 39. China System in Package (SiP) Technology Market, by Packaging Type – Revenue and Forecast to 2027 (USD Million)
Table 40. China System in Package (SiP) Technology Market, by Interconnection Technology – Revenue and Forecast to 2027 (USD Million)
Table 41. China System in Package (SiP) Technology Market, by End-user Industry – Revenue and Forecast to 2027 (USD Million)
Table 42. Japan System in Package (SiP) Technology Market, by Packaging Technology – Revenue and Forecast to 2027 (USD Million)
Table 43. Japan System in Package (SiP) Technology Market, by Packaging Type – Revenue and Forecast to 2027 (USD Million)
Table 44. Japan System in Package (SiP) Technology Market, by Interconnection Technology – Revenue and Forecast to 2027 (USD Million)
Table 45. Japan System in Package (SiP) Technology Market, by End-user Industry – Revenue and Forecast to 2027 (USD Million)
Table 46. Australia System in Package (SiP) Technology Market, by Packaging Technology – Revenue and Forecast to 2027 (USD Million)
Table 47. Australia System in Package (SiP) Technology Market, by Packaging Type – Revenue and Forecast to 2027 (USD Million)
Table 48. Australia System in Package (SiP) Technology Market, by Interconnection Technology – Revenue and Forecast to 2027 (USD Million)
Table 49. Australia System in Package (SiP) Technology Market, by End-user Industry – Revenue and Forecast to 2027 (USD Million)
Table 50. India System in Package (SiP) Technology Market, by Packaging Technology – Revenue and Forecast to 2027 (USD Million)
Table 51. India System in Package (SiP) Technology Market, by Packaging Type – Revenue and Forecast to 2027 (USD Million)
Table 52. India System in Package (SiP) Technology Market, by Interconnection Technology – Revenue and Forecast to 2027 (USD Million)
Table 53. India System in Package (SiP) Technology Market, by End-User Industry – Revenue and Forecast to 2027 (USD Million)
Table 54. South Korea System in Package (SiP) Technology Market, by Packaging Technology – Revenue and Forecast to 2027 (USD Million)
Table 55. South Korea System in Package (SiP) Technology Market, by Packaging Type – Revenue and Forecast to 2027 (USD Million)
Table 56. South Korea System in Package (SiP) Technology Market, by Interconnection Technology – Revenue and Forecast to 2027 (USD Million)
Table 57. South Korea System in Package (SiP) Technology Market, by End-user Industry – Revenue and Forecast to 2027 (USD Million)
Table 58. Rest of Asia-Pacific System in Package (SiP) Technology Market, by Packaging Technology – Revenue and Forecast to 2027 (USD Million)
Table 59. Rest of Asia-Pacific System in Package (SiP) Technology Market, by Packaging Type – Revenue and Forecast to 2027 (USD Million)
Table 60. Rest of Asia-Pacific System in Package (SiP) Technology Market, by Interconnection Technology – Revenue and Forecast to 2027 (USD Million)
Table 61. Rest of Asia-Pacific System in Package (SiP) Technology Market, by End-user Industry – Revenue and Forecast to 2027 (USD Million)
Table 62. MEA System in Package (SiP) Technology Market, by Packaging Technology – Revenue and Forecast to 2027 (USD Million)
Table 63. MEA System in Package (SiP) Technology Market, by Packaging Type – Revenue and Forecast to 2027 (USD Million)
Table 64. MEA System in Package (SiP) Technology Market, by Interconnection Technology – Revenue and Forecast to 2027 (USD Million)
Table 65. MEA System in Package (SiP) Technology Market, by End-user Industry – Revenue and Forecast to 2027 (USD Million)
Table 66. SAM System in Package (SiP) Technology Market, by Packaging Technology – Revenue and Forecast to 2027 (USD Million)
Table 67. SAM System in Package (SiP) Technology Market, by Packaging Type – Revenue and Forecast to 2027 (USD Million)
Table 68. SAM System in Package (SiP) Technology Market, by Interconnection Technology – Revenue and Forecast to 2027 (USD Million
Table 69. SAM System in Package (SiP) Technology Market, by End-user Industry – Revenue and Forecast to 2027 (USD Million)
Table 70. Glossary of Terms
LIST OF FIGURES
Figure 1. System in Package (SiP) Technology Market Segmentation
Figure 2. System in Package (SiP) Technology Market Segmentation - Geography
Figure 3. Global System in Package (SiP) Technology Market Overview
Figure 4. Asia Pacific Held the Largest Share in Global System in Package (SiP) Technology Market in 2018
Figure 5. System in Package (SiP) Technology Market, By Packaging Technology
Figure 6. Global System in Package (SiP) Technology Market, By Packaging Type
Figure 7. Global System in Package (SiP) Technology Market, By Interconnection Technology
Figure 8. Global System in Package (SiP) Technology Market, By End-User Industry
Figure 9. North America: PEST Analysis
Figure 10. Europe: PEST Analysis
Figure 11. APAC: PEST Analysis
Figure 12. Rest of The World: PEST Analysis
Figure 13. System in package (SiP) technology Market- Ecosystem Analysis
Figure 14. System in package (SiP) technology Market Impact Analysis of Drivers and Restraints
Figure 15. Geographic Overview of System in package (SiP) technology Market
Figure 16. Global System in Package (SiP) Technology Market Revenue Forecast and Analysis, (US$ Million)
Figure 17. SiP technology Market Breakdown, by packaging technology, 2017 & 2027 (%)
Figure 18. 2D IC Market Revenue and Forecast to 2027 (US$ Mn)
Figure 19. 2.5D IC Market Revenue and Forecast to 2027 (US$ Mn)
Figure 20. 3D IC Market Revenue and Forecast to 2027 (US$ Mn)
Figure 21. SiP Technology Market Breakdown, By Packaging Type, 2017 & 2027 (%)
Figure 22. Global Flip-Chip/ Wire-Bond Sip Market Revenue and Forecast to 2027 (US$ MN)
Figure 23. Global Fan-Out SiP Market Revenue and Forecast to 2027 (US$ Mn)
Figure 24. Global Embedded SiP Market Revenue and Forecast to 2027 (US$ Mn)
Figure 25. Global SiP Technology Market Breakdown, By INTERCONNECTION TECHNIQUE, 2017 &2027 (%)
Figure 26. Small Outline Market Revenue and Forecast to 2027 (US$ Mn)
Figure 27. Flat Packages Market Revenue and Forecast to 2027 (US$ Mn)
Figure 28. Global Pin Grid Arrays Market Revenue and Forecast to 2027 (US$ Mn)
Figure 29. Global Surface Mount Market Revenue and Forecast to 2027 (US$ Mn)
Figure 30. Global Others Market Revenue and Forecast to 2027 (US$ Mn)
Figure 31. Global SiP Technology Market Breakdown, By END-USER INDUSTRY, 2017 &2027 (%)
Figure 32. Global Automotive Market Revenue and Forecast to 2027 (US$ Mn)
Figure 33. Global Aerospace and Defense Market Revenue and Forecast to 2027 (US$ Mn)
Figure 34. Global Consumer Electronics Market Revenue and Forecast to 2027 (US$ Mn)
Figure 35. Global Telecommunication Market Revenue and Forecast to 2027 (US$ Mn)
Figure 36. Global Others Market Revenue and Forecast to 2027 (US$ Mn)
Figure 37. SiP technology Market Revenue Share, By Region (2019 and 2027)
Figure 38. North America: SiP technology Market – Revenue and Forecast to 2027 (US$ Million)
Figure 39. North America SiP Technology Market Revenue Share, By Country (2019 and 2027)
Figure 40. North America SiP Technology Market Revenue Share, By Packaging Technology (2019 and 2027)
Figure 41. North America SiP Technology Market Revenue Share, By Packaging Type (2019 and 2027)
Figure 42. North America SiP Technology Market Revenue Share, By Interconnection Technology (2019 and 2027)
Figure 43. North America SiP Technology Market Revenue Share, By End-user Industry (2019 and 2027)
Figure 44. United States: SiP technology Market – Revenue and Forecast to 2027 (US$ Million)
Figure 45. Canada: SiP technology Market – Revenue and Forecast to 2027 (US$ Million)
Figure 46. Mexico: SiP technology Market – Revenue and Forecast to 2027 (US$ Million)
Figure 47. Europe: SiP technology Market – Revenue and Forecast to 2027 (US$ Million)
Figure 48. Europe SiP Technology Market Revenue Share, By Country (2019 and 2027)
Figure 49. Europe SiP Technology Market Revenue Share, By Packaging Technology (2019 and 2027)
Figure 50. Europe SiP Technology Market Revenue Share, By Packaging Type (2019 and 2027)
Figure 51. Europe SiP Technology Market Revenue Share, By Interconnection Technology (2019 and 2027)
Figure 52. Europe SiP Technology Market Revenue Share, By End-user Industry (2019 and 2027)
Figure 53. France SiP Technology System Market Revenue and Forecasts to 2027 (US$ million)
Figure 54. Germany SiP Technology Market Revenue and Forecast to 2027 (US$ million)
Figure 55. Italy SiP Technology System Market Revenue and Forecasts to 2027 (US$ million)
Figure 56. United Kingdom SiP Technology Market Revenue and Forecasts to 2027 (US$ million)
Figure 57. Russia SiP Technology Market Revenue and Forecasts to 2027 (US$ million)
Figure 58. Rest of Europe SiP Technology Market Revenue and Forecasts to 2027 (US$ million)
Figure 59. Asia Pacific: SiP technology Market – Revenue and Forecast to 2027 (US$ Million)
Figure 60. Asia Pacific SiP Technology Market Revenue Share, By Country (2019 and 2027)
Figure 61. Asia Pacific SiP Technology Market Revenue Share, By Packaging Technology (2019 and 2027)
Figure 62. Asia Pacific SiP Technology Market Revenue Share, By Packaging Type (2019 and 2027)
Figure 63. Asia Pacific SiP Technology Market Revenue Share, By Interconnection Technology (2019 and 2027)
Figure 64. Asia Pacific SiP Technology Market Revenue Share, By End-user Industry (2019 and 2027)
Figure 65. China SiP Technology System Market Revenue and Forecasts to 2027 (US$ million)
Figure 66. Japan SiP Technology Market Revenue and Forecast to 2027 (US$ million)
Figure 67. Australia SiP Technology System Market Revenue and Forecasts to 2027 (US$ million)
Figure 68. India SiP Technology Market Revenue and Forecasts to 2027 (US$ million)
Figure 69. South Korea SiP Technology Market Revenue and Forecasts to 2027 (US$ million)
Figure 70. Rest of Asia Pacific SiP Technology Market Revenue and Forecasts to 2027 (US$ million)
Figure 71. Rest of World: System in Package (SiP) Technology Market – Revenue and Forecast to 2027 (US$ Million)
Figure 72. RoW: System in Package (SiP) Technology Market Revenue Share, By Country (2019 and 2027)
Figure 73. RoW SiP Technology Market Revenue Share, By Packaging Technology (2019 and 2027)
Figure 74. RoW SiP Technology Market Revenue Share, By Packaging Type (2019 and 2027)
Figure 75. RoW SiP Technology Market Revenue Share, By Interconnection Technology (2019 and 2027)
Figure 76. RoW SiP Technology Market Revenue Share, By End-user Industry (2019 and 2027)
Figure 77. MEA: System in Package (SiP) Technology Market – Revenue and Forecast to 2027 (US$ Million)
Figure 78. SAM: System in Package (SiP) Technology Market – Revenue and Forecast to 2027 (US$ Million)
Figure 79. Impact of COVID-19 Pandemic in North American Country Markets
Figure 80. Impact of COVID-19 Pandemic in Europe Country Markets
Figure 81. Impact of COVID-19 Pandemic in APAC Country Markets
Figure 82. Impact of COVID-19 Pandemic in Rest of the World Country Markets
The List of Companies - System in Package (SiP) Technology Market
- Amkor Technology, Inc.
- ASE Technology Holding Co. Ltd
- ChipMOS TECHNOLOGIES INC.
- GS Nanotech
- JCET Group Co., Ltd.
- QUALCOMM INCORPORATED
- Samsung
- Renesas Electronics Corporation
- Texas Instruments Incorporated
- Taiwan Semiconductor Manufacturing Company, Limited
The Insight Partners performs research in 4 major stages: Data Collection & Secondary Research, Primary Research, Data Analysis and Data Triangulation & Final Review.
- Data Collection and Secondary Research:
As a market research and consulting firm operating from a decade, we have published many reports and advised several clients across the globe. First step for any study will start with an assessment of currently available data and insights from existing reports. Further, historical and current market information is collected from Investor Presentations, Annual Reports, SEC Filings, etc., and other information related to company’s performance and market positioning are gathered from Paid Databases (Factiva, Hoovers, and Reuters) and various other publications available in public domain.
Several associations trade associates, technical forums, institutes, societies and organizations are accessed to gain technical as well as market related insights through their publications such as research papers, blogs and press releases related to the studies are referred to get cues about the market. Further, white papers, journals, magazines, and other news articles published in the last 3 years are scrutinized and analyzed to understand the current market trends.
- Primary Research:
The primarily interview analysis comprise of data obtained from industry participants interview and answers to survey questions gathered by in-house primary team.
For primary research, interviews are conducted with industry experts/CEOs/Marketing Managers/Sales Managers/VPs/Subject Matter Experts from both demand and supply side to get a 360-degree view of the market. The primary team conducts several interviews based on the complexity of the markets to understand the various market trends and dynamics which makes research more credible and precise.
A typical research interview fulfils the following functions:
- Provides first-hand information on the market size, market trends, growth trends, competitive landscape, and outlook
- Validates and strengthens in-house secondary research findings
- Develops the analysis team’s expertise and market understanding
Primary research involves email interactions and telephone interviews for each market, category, segment, and sub-segment across geographies. The participants who typically take part in such a process include, but are not limited to:
- Industry participants: VPs, business development managers, market intelligence managers and national sales managers
- Outside experts: Valuation experts, research analysts and key opinion leaders specializing in the electronics and semiconductor industry.
Below is the breakup of our primary respondents by company, designation, and region:
Once we receive the confirmation from primary research sources or primary respondents, we finalize the base year market estimation and forecast the data as per the macroeconomic and microeconomic factors assessed during data collection.
- Data Analysis:
Once data is validated through both secondary as well as primary respondents, we finalize the market estimations by hypothesis formulation and factor analysis at regional and country level.
- 3.1 Macro-Economic Factor Analysis:
We analyse macroeconomic indicators such the gross domestic product (GDP), increase in the demand for goods and services across industries, technological advancement, regional economic growth, governmental policies, the influence of COVID-19, PEST analysis, and other aspects. This analysis aids in setting benchmarks for various nations/regions and approximating market splits. Additionally, the general trend of the aforementioned components aid in determining the market's development possibilities.
- 3.2 Country Level Data:
Various factors that are especially aligned to the country are taken into account to determine the market size for a certain area and country, including the presence of vendors, such as headquarters and offices, the country's GDP, demand patterns, and industry growth. To comprehend the market dynamics for the nation, a number of growth variables, inhibitors, application areas, and current market trends are researched. The aforementioned elements aid in determining the country's overall market's growth potential.
- 3.3 Company Profile:
The “Table of Contents” is formulated by listing and analyzing more than 25 - 30 companies operating in the market ecosystem across geographies. However, we profile only 10 companies as a standard practice in our syndicate reports. These 10 companies comprise leading, emerging, and regional players. Nonetheless, our analysis is not restricted to the 10 listed companies, we also analyze other companies present in the market to develop a holistic view and understand the prevailing trends. The “Company Profiles” section in the report covers key facts, business description, products & services, financial information, SWOT analysis, and key developments. The financial information presented is extracted from the annual reports and official documents of the publicly listed companies. Upon collecting the information for the sections of respective companies, we verify them via various primary sources and then compile the data in respective company profiles. The company level information helps us in deriving the base number as well as in forecasting the market size.
- 3.4 Developing Base Number:
Aggregation of sales statistics (2020-2022) and macro-economic factor, and other secondary and primary research insights are utilized to arrive at base number and related market shares for 2022. The data gaps are identified in this step and relevant market data is analyzed, collected from paid primary interviews or databases. On finalizing the base year market size, forecasts are developed on the basis of macro-economic, industry and market growth factors and company level analysis.
- Data Triangulation and Final Review:
The market findings and base year market size calculations are validated from supply as well as demand side. Demand side validations are based on macro-economic factor analysis and benchmarks for respective regions and countries. In case of supply side validations, revenues of major companies are estimated (in case not available) based on industry benchmark, approximate number of employees, product portfolio, and primary interviews revenues are gathered. Further revenue from target product/service segment is assessed to avoid overshooting of market statistics. In case of heavy deviations between supply and demand side values, all thes steps are repeated to achieve synchronization.
We follow an iterative model, wherein we share our research findings with Subject Matter Experts (SME’s) and Key Opinion Leaders (KOLs) until consensus view of the market is not formulated – this model negates any drastic deviation in the opinions of experts. Only validated and universally acceptable research findings are quoted in our reports.
We have important check points that we use to validate our research findings – which we call – data triangulation, where we validate the information, we generate from secondary sources with primary interviews and then we re-validate with our internal data bases and Subject matter experts. This comprehensive model enables us to deliver high quality, reliable data in shortest possible time.
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