基于(关键地区、市场参与者、规模和份额)的射频前端芯片市场 - 到 2030 年的预测

  • Report Code : TIPRE00017165
  • Category : Electronics and Semiconductor
  • Status : Published
  • No. of Pages : 209
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【研究报告】2022年射频前端芯片市场估值为185.2亿美元,预计到2030年将达到471.0亿美元;预计 2022 年至 2030 年复合年增长率将达到 12.4%。

分析师观点:

智能手机、平板电脑和其他消费电子产品的需求不断增加,加上 5G 在全球的推出网络,正在推动射频前端芯片市场的增长。此外,无线通信、物联网和人工智能的发展推动了市场增长。射频前端芯片作为无线通信设备和系统的重要组成部分,负责射频信号的发送和接收。这些芯片在提高智能手机、平板电脑和物联网等移动设备的信号质量、提高数据传输速度和降低电池消耗方面发挥着重要作用。由于高速数据传输需求的激增和无线通信技术的快速进步,射频前端芯片市场正在迅速扩大。随着 5G 网络的发展,对能够支持多模式、多频段操作的射频前端设备的需求不断增加,从而实现更好的网络连接和更快的数据速率。此外,射频前端模块和多芯片前端模块的小型化预计将在未来几年带来新的射频前端芯片市场趋势。

射频前端芯片市场概述:< br>
射频前端芯片是指介于天线和数字基带系统之间的一切。对于接收器来说,这个“之间”区域包括所有滤波器、低噪声放大器 (LNA) 和下变频混频器,这些滤波器、低噪声放大器 (LNA) 和下变频混频器将天线接收到的调制信号转换为可接受的输入基带模拟信号-数字转换器。 RF 前端是一种设备或模块,包含将天线连接到接收器和发射器功率放大器的至少一个混频级的所有电路。它们被用于各种射频产品和应用。例如 Wi-Fi 和 FM 无线电系统。

战略见解

射频前端芯片市场驱动因素:

智能手机、平板电脑和其他消费电子产品的采用率不断上升有助于不断增长的射频前端芯片市场规模

根据 GSMA 年度《2023 年移动互联网连接状况报告》(SOMIC),2023 年 10 月,全球人口的一半以上 (54%) - 约 43 亿人-拥有一部智能手机。智能手机的数量正在显着增加。例如,根据爱立信和 Radicati Group 的数据,2020 年智能手机数量为 57.5 亿部。 2024年,智能手机数量预计将增至69.3亿部,2025年预计将达到71.5亿部。此外,近年来,平板电脑变得越来越受欢迎,因为它们比传统笔记本电脑和台式电脑具有一系列优势。平板电脑、智能手机、耳机和可穿戴设备等互联设备的日益普及,进一步推动了对射频前端芯片的需求。智能手机和平板电脑通常支持多种无线服务,包括跨多个频段的 FM 收音机和 LTE。与此同时,越来越多的智能手机和平板电脑使用多个天线来提高灵敏度并减少串扰。微型射频固态开关在智能移动设备的射频前端设计中发挥着至关重要的作用。消费者期望无缝连接和高数据速度,这促使制造商将先进的射频技术融入到他们的设备中。因此,各市场参与者纷纷推出针对智能手机的射频前端解决方案。例如,2020年5月,恩智浦半导体宣布其最新的采用Wi-Fi 6标准设计的射频前端(RFFE)解决方案已集成到小米10 5G智能手机中。因此,智能手机、平板电脑和其他消费电子产品的日益普及正在促进射频前端芯片市场增长的扩大。

射频前端芯片市场报告细分和范围:

射频前端芯片市场根据组件和应用进行细分。根据组件,射频前端芯片市场分为功率放大器、射频开关、射频滤波器、低噪声放大器等。根据应用,射频前端芯片市场分为消费电子、无线、通信等。射频前端芯片市场报告范围涵盖北美(美国、加拿大和墨西哥)、欧洲(西班牙、英国、德国、法国、意大利和欧洲其他地区)、亚太地区(韩国、中国、印度、日本、澳大利亚和亚太地区其他地区)、中东和非洲(南非、沙特阿拉伯、阿联酋以及中东和非洲其他地区)以及南美洲和中美洲(巴西、阿根廷) ,以及南美洲和中美洲其他地区)。

射频前端芯片市场细分分析:

根据组件,射频前端芯片市场细分为功率放大器、射频开关、射频滤波器、低噪声放大器等。从收入来看,功率放大器细分市场在2022年将占据最大的射频前端芯片市场份额。功率放大器用于增加射频信号的功率。它们在为多种应用的无线通信提供足够的功率和范围方面发挥着重要作用。全球多家厂商都在致力于功率放大器的开发。例如,2023 年 9 月,RFHIC 公司发布了适用于 4G LTE 和 5G 系统的新系列 SDM GaN 混合功率放大器模块。SDM 系列采用 RFHIC 的 GaN-on-SiC 技术,专为驱动放大器应用而设计。大规模 MIMO 系统、小型基站和低功耗远程无线电头。产品推出的增加推动了射频前端芯片市场中功率放大器部分的增长。

射频前端芯片市场区域分析:

就收入而言,亚太地区由于高速数据连接需求的增加、智能手机普及率的提高以及通信网络的扩展,射频前端芯片市场份额占据主导地位。 5G网络的发展主要推动亚太射频前端芯片市场。韩国、中国和日本等国家处于 5G 采用的最前沿,这增加了对能够处理高频段和先进通信协议复杂性的射频开关的需求。据互联网世界统计,截至2022年7月,亚太地区互联网用户数量为2,934,186,678人,普及率为67.4%。此外,截至2023年11月,中国拥有世界上第一个超高速下一代互联网骨干网。高速互联网连接的激增预计将推动对射频前端芯片的需求,因为它有助于通过天线放大、过滤和传输信号。它还处理与高速互联网相关的复杂信号和更高频率。因此,所有这些因素都推动了射频前端芯片市场的增长。

主要参与者分析:

Broadcom Corporation;英飞凌科技股份公司;微芯科技公司;村田制作所;恩智浦半导体公司; Qorvo 公司; Skyworks 解决方案公司;意法半导体; TDK公司;和德州仪器公司是射频前端芯片市场的主要参与者之一。在本市场研究期间,对其他几个主要市场参与者进行了研究和分析,以全面了解市场及其生态系统。射频前端芯片市场分析提供了详细的市场洞察,帮助主要参与者制定增长战略。

射频前端芯片市场最新动态:

射频前端芯片市场预测可以帮助该市场的利益相关者规划他们的增长战略。市场上的公司高度采用并购等无机和有机策略。下面列出了公司新闻稿中的一些近期关键市场动态:

2023 年 6 月,Qorvo 宣布推出 QPQ3509,这是首款体声波 (BAW) 280 MHz 带通滤波器,适用于北美推出新的 5G C 频段,以及用于 5G 基站射频前端的紧凑型、高度集成的前端开关/低噪声放大器 (LNA) 模块 QPB9850。 QPQ3509 的 C 频段覆盖范围与 QPB9850 的高集成度和紧凑型设计相结合,使该器件非常适合以尺寸和重量为关键指标的 5G 小型蜂窝应用。2023 年 9 月,Qorvo 推出了两款体声波 (BAW) 滤波器支持正在进行的全球5G基站部署。新型 QPQ3500 和 QPQ3501 滤波器为基站 OEM 提供引脚兼容的 5G 滤波器解决方案,与同类产品相比,可提供更低的插入损耗和卓越的带外抑制。引脚兼容性允许使用支持不同频段的通用印刷电路板,从而消除了成本高昂的电路板重新设计并缩短了上市时间。 2023 年 6 月,博通公司推出了四个射频前端模块,用于为使用 Wi-Fi 7 的路由器供电,Wi-Fi 7 是一种新的技术。无线网络标准。这些模块还可用于构建 Wi-Fi 接入点 (AP),即企业用于无线连接的设备。2021 年 3 月,Qorvo 宣布增加其 RF Fusion20 产品组合的出货量,这是其屡获殊荣的集成 5G 系列的扩展射频前端 (RFFE) 模块,面向所有主要 5G 智能手机制造商。 Fusion20 增加了接收路径集成和射频屏蔽,以一整套配置提供完整的发射和接收覆盖,以满足不同区域市场的需求。
Report Coverage
Report Coverage

Revenue forecast, Company Analysis, Industry landscape, Growth factors, and Trends

Segment Covered
Segment Covered

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Regional Scope
Regional Scope

North America, Europe, Asia Pacific, Middle East & Africa, South & Central America

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Frequently Asked Questions


What is the estimated market size for the RF front-end chip market in 2022?

The RF front-end chip market was estimated to be valued at US$ 18.52 billion in 2022 and is projected to reach US$ 47.10 billion by 2030; it is expected to grow at a CAGR of 12.4% during the forecast period.

What are the driving factors impacting the RF front-end chip market?

Increasing adoption of wireless network infrastructure and rising adoption of smartphones, tablets, and other consumer electronics products are driving factors of RF front-end chip market.

What are the future trends of the RF front-end chip market?

Miniaturization of RF frond-end modules and multi-chip front-end modules is expected to set the future trend for the RF front-end chip market in the coming years.

Which key players hold the major market share of the RF front-end chip market?

The key players holding majority shares in the RF front-end chip market include Qualcomm Technologies, Inc., Murata Manufacturing Co., Ltd, Qorvo, Inc, Broadcom., and STMicroelectronics.

Which is the fastest-growing region in RF front-end chip market?

Asia Pacific is anticipated to grow with the highest CAGR over the forecast period.

Which is the leading component segment in the RF front-end chip market?

Power amplifier segment led the RF front-end chip market with a significant share in 2022 and low noise amplifier segment is expected to grow with the highest CAGR.

What will be the RF front-end chip market size by 2030?

The RF front-end chip market is expected to reach US$ 47.10 billion by 2030.

The List of Companies - RF Front-End Chip Market

  1. Infineon Technologies AG
  2. TDK Corp 
  3. Texas Instruments Inc
  4. Broadcom Inc
  5. Qorvo Inc 
  6. Skyworks Solutions Inc 
  7. STMicroelectronics NV 
  8. Murata Manufacturing Co Ltd 
  9. Microchip Technology Inc 
  10. NXP Semiconductors NV

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Below is the breakup of our primary respondents by company, designation, and region:

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