系统级封装 (SiP) 技术市场基于(主要区域、市场参与者、规模和贡献)- 预测至 2031 年

  • Report Code : TIPRE00005443
  • Category : Electronics and Semiconductor
  • No. of Pages : 150
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System in Package (SiP) Technology Market Growth Scope 2031

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系统级封装 (SiP) 技术市场规模预计将从 2023 年的 153.6 亿美元增至 2031 年的 352 亿美元。预计 2023 年至 2031 年该市场的复合年增长率为 10.9%。对电子产品小型化不断增长的需求可能仍然是系统级封装 (SiP) 技术市场的一个关键趋势。

 

系统级封装 (SiP) 技术市场分析

预计 5G 网络连接设备的引入、对具有互联网连接功能的小型电子设备的需求增加以及物联网 (IoT) 设备的激增将推动全球系统级封装 (SiP) 的增长科技业务。此外,由于智能手机和智能可穿戴设备的使用不断增加,该行业正在发展。然而,更高水平的集成可能会导致散热问题,这是一个重大的市场限制。相反,预计亚太地区的强劲需求将在整个预计时间内支持市场扩张。

 

系统级封装 (SiP) 技术市场概览

称为“系统级封装”(SiP) 的封装技术在一个基板上集成了许多无源和电气子元件。系统级封装 (SiP) 技术的主要优点之一是它允许具有多个芯片的 IC 封装与IC 封装内的有源系统或子系统相结合。系统级封装 (SiP) 技术的市场扩张预计将因发展中国家(尤其是汽车领域)越来越多地采用 SiP 产品而得到推动。由于微电子设备中对电路小型化的需求日益增长等因素,该市场正在以更快的速度增长。此外,包装设计的最新趋势是系统化。

 

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系统级封装 (SiP) 技术市场:

系统级封装 (SiP) 技术市场

  • 年均复合增长率(2023 - 2031)
    10.9%
  • 2023年市场规模
    153.6亿美元
  • 2031 年市场规模
    352 亿美元

市场动态

增长动力
  • 不断增长的汽车工业
未来的趋势
  • 对电子产品小型化的需求不断增长
机会
  • 射频组件在开发先进 5G 基础设施中的潜在用途

关键人物;主力;重要一员

  • 日月光集团
  • Amkor 技术公司
  • 茂茂科技股份有限公司
  • 富士通有限公司
  • GS纳米科技
  • 长电科技集团有限公司
  • 高通技术公司
  • 瑞萨电子公司
  • 三星电子有限公司
  • 德州仪器公司

区域概况

  • 北美
  • 欧洲
  • 亚太
  • 南美洲和中美洲
  • 中东和非洲

市场细分

封装技术
  • 二维集成电路
  • 2.5D集成电路
  • 3D集成电路
包装类型
  • 倒装芯片/引线键合 SiP
  • 扇出SiP
  • 嵌入式 SiP
互连技术
  • 小轮廓
  • 扁平封装
  • 针栅阵列
  • 表面贴装
  • 其他的
最终用户行业
  • 汽车
  • 航空航天和国防
  • 消费类电子产品
  • 电信
  • 其他的
  • 示例 PDF 通过定性和定量分析展示了内容结构和信息的性质。

 

系统级封装 (SiP) 技术市场驱动因素和机遇

不断发展的汽车工业

由于化石燃料的敏感性不断提高以及政府对清洁环境的措施不断增加,汽车行业,特别是电动汽车将在预测期内出现增长。例如,在汽车领域,通用汽车等巨头计划在 2021 年发布自动驾驶汽车,而奥迪则与英伟达合作开发非人类监督汽车模型的能力。这款高度自动化汽车的原型基于奥迪的Q7车型。 SIP技术应用于智能和电动汽车的电子元件,如电源模块(ADI µModules)、传感器(MEMS)、变速箱控制单元、车辆中央信息娱乐单元、单芯片模块等。因此,不断增长的汽车行业推动系统级封装 (SiP) 技术市场的增长。

 

RF 组件在开发先进 5G 基础设施中的潜在用途

未来五年,由于支持高带宽的设备的可用性,无线网络将出现严重拥塞。这将加速当前 3G 和 4G LTE 技术向 5G 的过渡。预计 5G 技术将实现比当前 4G 和 3G 数据速率分别快得多的聚合数据速率。

包括美国、日本、韩国、英国、德国和中国在内的许多重要国家预计将在 2021 年实施 5G 技术。预计这将导致移动用户数量大幅增加,需要开发能够处理用户数据需求的基础设施。因此,为了传输更多数据,基于 SiP 的射频组件将会增加。因此,在预测期内,射频组件在开发先进 5G 基础设施中的潜在用途预计将为系统级封装 (SiP) 技术市场参与者带来新的机遇。

 

系统级封装 (SiP) 技术市场报告细分分析

有助于系统级封装 (SiP) 技术市场分析的关键部分是封装技术、封装类型、互连技术和最终用途行业。

  • 根据封装技术,系统级封装(SiP)技术市场分为2D IC、2.5D IC和3D IC。
  • 按封装类型划分,市场分为倒装芯片、引线键合和扇出晶圆级封装。
  • 根据互连技术,市场分为小外形、扁平封装、针栅阵列、表面贴装等。
  • 根据最终用途行业,系统级封装 (SiP) 技术市场分为汽车、航空航天和国防、消费电子、电信等。

按地区划分的系统级封装 (SiP) 技术市场份额分析

系统级封装(SiP)技术市场报告的地理范围主要分为五个地区:北美、亚太地区、欧洲、中东和非洲、南美洲/中南美洲。就收入而言,亚太地区占据最大的系统级封装(SiP)技术市场份额。这归因于中国、印度和韩国等新兴经济国家的需求激增。 

 

系统级封装 (SiP) 技术市场报告范围

报告属性细节
2023年市场规模153.6亿美元
2031 年市场规模352亿美元
全球复合年增长率(2023 - 2031)10.9%
历史数据2021-2022
预测期2024-2031
涵盖的细分市场按封装技术
  • 二维集成电路
  • 2.5D集成电路
  • 3D集成电路
按包装类型
  • 倒装芯片/引线键合 SiP
  • 扇出SiP
  • 嵌入式 SiP
通过互连技术
  • 小轮廓
  • 扁平封装
  • 针栅阵列
  • 表面贴装
  • 其他的
按最终用户行业
  • 汽车
  • 航空航天和国防
  • 消费类电子产品
  • 电信
  • 其他的
覆盖地区和国家北美
  • 我们
  • 加拿大
  • 墨西哥
欧洲
  • 英国
  • 德国
  • 法国
  • 俄罗斯
  • 意大利
  • 欧洲其他地区
亚太
  • 中国
  • 印度
  • 日本
  • 澳大利亚
  • 亚太其他地区
南美洲和中美洲
  • 巴西
  • 阿根廷
  • 南美洲和中美洲其他地区
中东和非洲
  • 南非
  • 沙特阿拉伯
  • 阿联酋
  • 中东和非洲其他地区
市场领导者和主要公司简介
  • 日月光集团
  • Amkor 技术公司
  • 茂茂科技股份有限公司
  • 富士通有限公司
  • GS纳米科技
  • 长电科技集团有限公司
  • 高通技术公司
  • 瑞萨电子公司
  • 三星电子有限公司
  • 德州仪器公司
  • 示例 PDF 通过定性和定量分析展示了内容结构和信息的性质。

 

系统级封装 (SiP) 技术市场新闻和最新发展

系统级封装 (SiP) 技术市场是通过收集初级和二级研究后的定性和定量数据来评估的,其中包括重要的公司出版物、协会数据和数据库。以下是言语和语言障碍市场的发展及策略列表:

  • 2023 年 3 月,Octavo Systems 推出的 OSD62x 系列片上系统 (Sip) 产品有助于增强边缘和小型嵌入式处理的性能,以用于下一代应用。 Texas Instruments (Tl) AM623 和 AM625 处理器是 OSD62x 系列的基础。

(来源:Octavo Systems,新闻稿)

 

系统级封装 (SiP) 技术市场报告范围和交付成果

《系统级封装 (SiP) 技术市场规模和预测(2021-2031)》报告对涵盖以下领域的市场进行了详细分析:

  • 范围内涵盖的所有关键细分市场的全球、区域和国家层面的市场规模和预测
  • 市场动态,例如驱动因素、限制因素和关键机遇
  • 未来主要趋势
  • 详细的 PEST/波特五力分析和 SWOT 分析
  • 全球和区域市场分析,涵盖主要市场趋势、主要参与者、法规和最新市场发展
  • 行业格局和竞争分析,涵盖市场集中度、热图分析、知名参与者和最新发展
  • 详细的公司简介
Report Coverage
Report Coverage

Revenue forecast, Company Analysis, Industry landscape, Growth factors, and Trends

Segment Covered
Segment Covered

This text is related
to segments covered.

Regional Scope
Regional Scope

North America, Europe, Asia Pacific, Middle East & Africa, South & Central America

Country Scope
Country Scope

This text is related
to country scope.

Frequently Asked Questions


What is the estimated market size for the global System in Package (SiP) technology market in 2023?

The global System in Package (SiP) technology market was estimated to be US$ 15.36 billion in 2023 and is expected to grow at a CAGR of 10.9 % during the forecast period 2023 - 2031.

What are the driving factors impacting the global System in Package (SiP) technology market?

The growing automotive industry and the potential use of RF components in developing advanced 5g infrastructure are the major factors that propel the global System in Package (SiP) technology market.

What are the future trends of the global System in Package (SiP) technology market?

The growing demand for the miniaturization of electronics is anticipated to play a significant role in the global System in Package (SiP) technology market in the coming years.

Which are the key players holding the major market share of the global System in Package (SiP) technology market?

The key players holding majority shares in the global System in Package (SiP) technology market are ASE Group, Amkor Technology, Inc., ChipMOS TECHNOLOGIES INC., Fujitsu Ltd., and GS Nanotech.

What will be the market size of the global System in Package (SiP) technology market by 2031?

The global System in Package (SiP) technology market is expected to reach US$ 35.20 billion by 2031.

The Insight Partners performs research in 4 major stages: Data Collection & Secondary Research, Primary Research, Data Analysis and Data Triangulation & Final Review.

  1. Data Collection and Secondary Research:

As a market research and consulting firm operating from a decade, we have published and advised several client across the globe. First step for any study will start with an assessment of currently available data and insights from existing reports. Further, historical and current market information is collected from Investor Presentations, Annual Reports, SEC Filings, etc., and other information related to company’s performance and market positioning are gathered from Paid Databases (Factiva, Hoovers, and Reuters) and various other publications available in public domain.

Several associations trade associates, technical forums, institutes, societies and organization are accessed to gain technical as well as market related insights through their publications such as research papers, blogs and press releases related to the studies are referred to get cues about the market. Further, white papers, journals, magazines, and other news articles published in last 3 years are scrutinized and analyzed to understand the current market trends.

  1. Primary Research:

The primarily interview analysis comprise of data obtained from industry participants interview and answers to survey questions gathered by in-house primary team.

For primary research, interviews are conducted with industry experts/CEOs/Marketing Managers/VPs/Subject Matter Experts from both demand and supply side to get a 360-degree view of the market. The primary team conducts several interviews based on the complexity of the markets to understand the various market trends and dynamics which makes research more credible and precise.

A typical research interview fulfils the following functions:

  • Provides first-hand information on the market size, market trends, growth trends, competitive landscape, and outlook
  • Validates and strengthens in-house secondary research findings
  • Develops the analysis team’s expertise and market understanding

Primary research involves email interactions and telephone interviews for each market, category, segment, and sub-segment across geographies. The participants who typically take part in such a process include, but are not limited to:

  • Industry participants: VPs, business development managers, market intelligence managers and national sales managers
  • Outside experts: Valuation experts, research analysts and key opinion leaders specializing in the electronics and semiconductor industry.

Below is the breakup of our primary respondents by company, designation, and region:

Research Methodology

Once we receive the confirmation from primary research sources or primary respondents, we finalize the base year market estimation and forecast the data as per the macroeconomic and microeconomic factors assessed during data collection.

  1. Data Analysis:

Once data is validated through both secondary as well as primary respondents, we finalize the market estimations by hypothesis formulation and factor analysis at regional and country level.

  • Macro-Economic Factor Analysis:

We analyse macroeconomic indicators such the gross domestic product (GDP), increase in the demand for goods and services across industries, technological advancement, regional economic growth, governmental policies, the influence of COVID-19, PEST analysis, and other aspects. This analysis aids in setting benchmarks for various nations/regions and approximating market splits. Additionally, the general trend of the aforementioned components aid in determining the market's development possibilities.

  • Country Level Data:

Various factors that are especially aligned to the country are taken into account to determine the market size for a certain area and country, including the presence of vendors, such as headquarters and offices, the country's GDP, demand patterns, and industry growth. To comprehend the market dynamics for the nation, a number of growth variables, inhibitors, application areas, and current market trends are researched. The aforementioned elements aid in determining the country's overall market's growth potential.

  • Company Profile:

The “Table of Contents” is formulated by listing and analyzing more than 25 - 30 companies operating in the market ecosystem across geographies. However, we profile only 10 companies as a standard practice in our syndicate reports. These 10 companies comprise leading, emerging, and regional players. Nonetheless, our analysis is not restricted to the 10 listed companies, we also analyze other companies present in the market to develop a holistic view and understand the prevailing trends. The “Company Profiles” section in the report covers key facts, business description, products & services, financial information, SWOT analysis, and key developments. The financial information presented is extracted from the annual reports and official documents of the publicly listed companies. Upon collecting the information for the sections of respective companies, we verify them via various primary sources and then compile the data in respective company profiles. The company level information helps us in deriving the base number as well as in forecasting the market size.

  • Developing Base Number:

Aggregation of sales statistics (2020-2022) and macro-economic factor, and other secondary and primary research insights are utilized to arrive at base number and related market shares for 2022. The data gaps are identified in this step and relevant market data is analyzed, collected from paid primary interviews or databases. On finalizing the base year market size, forecasts are developed on the basis of macro-economic, industry and market growth factors and company level analysis.

  1. Data Triangulation and Final Review:

The market findings and base year market size calculations are validated from supply as well as demand side. Demand side validations are based on macro-economic factor analysis and benchmarks for respective regions and countries. In case of supply side validations, revenues of major companies are estimated (in case not available) based on industry benchmark, approximate number of employees, product portfolio, and primary interviews revenues are gathered. Further revenue from target product/service segment is assessed to avoid overshooting of market statistics. In case of heavy deviations between supply and demand side values, all thes steps are repeated to achieve synchronization.

We follow an iterative model, wherein we share our research findings with Subject Matter Experts (SME’s) and Key Opinion Leaders (KOLs) until consensus view of the market is not formulated – this model negates any drastic deviation in the opinions of experts. Only validated and universally acceptable research findings are quoted in our reports.

We have important check points that we use to validate our research findings – which we call – data triangulation, where we validate the information, we generate from secondary sources with primary interviews and then we re-validate with our internal data bases and Subject matter experts. This comprehensive model enables us to deliver high quality, reliable data in shortest possible time.

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