Flip Chip Technology Market Forecast to 2028 - COVID-19 Impact and Global Analysis by Wafer Bumping Process (Copper (Cu) Pillar, Lead-Free, Tin/lead Eutectic Solder, Gold Stud+ Plated Solder); Packaging Technology (2D IC, 2.5D IC, 3D IC); Packaging Type (FC BGA, FC PGA, FC LGA, FC QFN, FC SiP, FC CSP); Product (Memory, LED, CMOS Image Sensor, RF, Analog, Mixed Signal, and Power IC, CPU, SoC, GPU); Application (Consumer Electronics, Telecommunication, Automotive, Industrial Sector, Medical Devices, Smart Technologies, Military and Aerospace) and Geography
Report Code: TIPRE00012046
| No. of Pages: 150
| Category: Electronics and Semiconductor
| Status: Upcoming
The flip chip technology market is currently experiencing a huge growth owing to the advancement in micro bumping metallurgy and copper pillar and its protracted use in consumer electronics products and mobile phones. The most advanced packaging technologies are being served by new bumping solutions; therefore, in turn, flip chip technology can adapt to new challenges.
The rising consumer electronics industries are one of the major factors driving the growth of the flip chip technology market. Moreover, the rising application in automotive is another factor that is anticipated to boost the growth of the flip chip technology market.
The Global Flip Chip Technology Market Analysis to 2028 is a specialized and in-depth study of the flip chip technology market with a special focus on the global market trend analysis. The report aims to provide an overview of flip chip technology market with detailed market segmentation by wafer bumping process, packaging technology, packaging type, product, application. The global flip chip technology market is expected to witness high growth during the forecast period. The report provides key statistics on the market status of the leading flip chip technology market players and offers key trends and opportunities in the flip chip technology market.
The global flip chip technology market is segmented on the basis of wafer bumping process, packaging technology, packaging type, product, application. On the basis of wafer bumping process, the market is segmented as copper (Cu) pillar, lead-free, tin/lead eutectic solder, gold stud+ plated solder. On the basis of packaging technology, the market is segmented as 2D IC, 2.5D IC, 3D IC. On the basis of packaging type, the market is segmented as FC BGA, FC PGA, FC LGA, FC QFN, FC SiP, FC CSP. On the basis of product, the market is segmented as memory, LED, CMOS image sensor, RF, analog, mixed signal, and power IC, CPU, SoC, GPU. On the basis of application, the market is segmented as consumer electronics, telecommunication, automotive, industrial sector, medical devices, smart technologies, military & aerospace.
The report provides a detailed overview of the industry including both qualitative and quantitative information. It provides overview and forecast of the global flip chip technology market based on various segments. It also provides market size and forecast estimates from year 2020 to 2028 with respect to five major regions, namely; North America, Europe, Asia-Pacific (APAC), Middle East and Africa (MEA) and South America. The flip chip technology market by each region is later sub-segmented by respective countries and segments. The report covers analysis and forecast of 18 countries globally along with current trend and opportunities prevailing in the region.
The report analyzes factors affecting flip chip technology market from both demand and supply side and further evaluates market dynamics effecting the market during the forecast period i.e., drivers, restraints, opportunities, and future trend. The report also provides exhaustive PEST analysis for all five regions namely; North America, Europe, APAC, MEA and South America after evaluating political, economic, social and technological factors effecting the flip chip technology market in these regions.
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The reports cover key developments in the flip chip technology market as organic and inorganic growth strategies. Various companies are focusing on organic growth strategies such as product launches, product approvals and others such as patents and events. Inorganic growth strategies activities witnessed in the market were acquisitions, and partnership & collaborations. These activities have paved way for expansion of business and customer base of market players. The market players from flip chip technology market are anticipated to lucrative growth opportunities in the future with the rising demand for flip chip technology market. Below mentioned is the list of few companies engaged in the flip chip technology market.
The report also includes the profiles of key flip chip technology market companies along with their SWOT analysis and market strategies. In addition, the report focuses on leading industry players with information such as company profiles, components and services offered, financial information of last 3 years, key development in past five years.
FlipChip International LLC
Siliconware Precision Industries Co., Ltd.
STATS ChipPAC Ltd. (JCET Group)
Taiwan Semiconductor Manufacturing Company Limited
TF AMD Microelectronics (Penang) Sdn.Bhd.
UTAC (United Test and Assembly Center Ltd)
The Insight Partner's dedicated research and analysis team consist of experienced professionals with advanced statistical expertise and offer various customization options in the existing study.
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The List of Companies
1. Amkor Technology 2. ASE Group 3. FlipChip International LLC 4. Intel Corporation 5. SAMSUNG 6. Siliconware Precision Industries Co., Ltd. 7. STATS ChipPAC Ltd. (JCET Group) 8. Taiwan Semiconductor Manufacturing Company Limited 9. TF AMD Microelectronics (Penang) Sdn.Bhd. 10. UTAC (United Test and Assembly Center Ltd)