반도체 본딩 시장은 2022년 6억 6,948만 달러 규모였으며, 2022년부터 2028년까지 연평균 8.2% 성장할 것으로 예상됩니다.
칩, 자동차 및 산업 분야에서 반도체 본딩 시장의 성장을 강화할 것으로 예상됩니다. 자동차 시장은 2021년에 34.9%의 성장을 기록했습니다. 또한 스마트폰이 지배하는 무선 통신은 24.6%의 성장을 보였습니다. Semiconductor Today 데이터에 따르면 생산되는 5G 핸드셋의 수는 2020년 2억 5100만 대에서 2021년 5억 5600만 대로 증가했습니다. 또한 웨어러블, 스마트폰 및 5G 서비스에 대한 수요 증가는 반도체 본딩 시장 성장을 가속화할 것으로 예상됩니다. 예측 기간입니다.
EU 보고서에 따르면 유럽은 2030년까지 차세대 최첨단 칩(2nm) 생산을 목표로 하고 있습니다. Infineon Technologies 및 ASML Holding과 같은 유럽 반도체 회사는 연구 및 첨단 반도체 본딩 솔루션 개발을 위한 개발. 또한 반도체 본딩 분야의 유럽 스타트업 수가 증가함에 따라 반도체 산업에서 디지털 기술에 대한 새로운 기회가 제공될 것으로 예상됩니다. 또한 정부의 친환경 정책 지원으로 유럽 국가에서 전기 자동차 채택이 증가함에 따라 반도체 본딩 시장 성장에 기여할 것으로 예상됩니다. 예를 들어, 영국 정부는 환경 지속 가능성 표준을 지원하기 위해 2030년까지 모든 전기 자동차에 대한 목표를 설정했습니다.
반도체 본딩 시장 - 전략적 통찰력
유럽에 대한 COVID-19 팬데믹의 영향 반도체 본딩 시장 성장
유럽 반도체 본딩 시장은 2020년 2분기 COVID-19 대유행 기간 동안 상당한 타격을 받았습니다. 2020년 2분기 반도체 및 자동차 판매가 감소했습니다. 이러한 판매 부족은 원격 작업 및 학습 표준으로의 전환으로 인해 컴퓨터 및 전자 장비에 대한 수요 증가로 상쇄되었습니다. 유럽에는 메르세데스, 폭스바겐, 스코다, BMW, 아우디와 같은 다양한 주요 자동차 회사가 있습니다. 유럽의 자동차 부문은 OEM(Original Equipment Manufacturer)의 조립 공장 재개 지연, 반도체 부족, 차량 판매 감소로 인해 심각한 영향을 받았습니다. 따라서 반도체 칩의 부족과 운송 중단은 자동차 부품 공급업체의 운영과 반도체 기술 장비의 배송을 방해했습니다.
유럽의 반도체 본딩 부품 개발 및 생산은 주로 독일, 프랑스, 이탈리아에서 이루어집니다. , 네덜란드, 벨기에, 오스트리아, 아일랜드. 유럽 기업들은 자동차, 산업 자동화, 보안, 의료, 항공, 에너지 생산 및 통신 부문에 칩 및 웨이퍼 IC를 포함한 반도체 제품을 공급합니다. 예를 들어, 유럽 국가에서 5G 네트워크 개발을 위한 이니셔티브가 증가함에 따라 유럽 반도체 본딩 시장 성장도 강화될 것으로 예상됩니다.
반도체 본딩 시장의 유리한 지역
시장 통찰력 - 반도체 본딩 시장
IoT 장치에서 적층 다이 기술의 채택 증가
적층 다이의 사용은 반도체의 설계 프로세스를 크게 향상시킵니다. 스택 다이 기술은 작은 크기의 최종 디자인을 생산하는 데 사용됩니다. 스택 다이 기술을 발전시키는 주요 요인 중 하나는 휴대용 전자 장치입니다. 또한 실시간 추적 IoT 장치는 큰 크기로 제공되지 않습니다. 설계 노력을 줄이고 최초의 성공 가능성을 높임으로써 시장 출시 시간이 단축됩니다. 따라서 IoT 장치에서 스택형 다이 기술의 채택이 증가함에 따라 시장에서 반도체 본딩 솔루션에 대한 수요가 증가하고 있습니다.
반도체 부문에서 운영되는 OEM은 연결을 넘어 IoT의 이점을 활용하고 있습니다. 센서, RFID 태그, 스마트 비콘, 스마트 미터, 유통 관제 시스템은 빌딩 및 홈 오토메이션, 커넥티드 물류, 스마트 제조, 스마트 리테일, 스마트 모빌리티, 스마트 등 다양한 응용 분야에서 점점 더 많이 사용되고 있는 IoT 장치 및 기술입니다. 운송. IoT 기기에서 반도체 본딩 기술은 여러 개의 적층된 다이를 기판에 콤팩트하게 부착하는 데 활용되며, 이는 반도체 본딩 시장의 성장으로 이어질 것입니다.
Type-Based Insights - Semiconductor Bonding Market
< 유형에 따라 시장은 다이 본더, 웨이퍼 본더 및 플립 칩 본더로 분류됩니다. 웨이퍼 본더 부문은 2021년 시장에서 가장 큰 점유율을 차지했습니다.
산업 응용 분야에서 두 기판의 안정적인 접합 및 본딩에 대한 요구가 증가함에 따라 웨이퍼 본더에 대한 수요가 높습니다. 웨이퍼 본딩은 병렬 시스템에서 Si 재료에 여러 III-V 레이저를 제조하는 가장 빠른 솔루션 중 하나입니다. 스마트폰, 스마트 웨어러블, 스마트 조명 및 기타 RF 장치와 같은 소비자 전자 장치에 대한 수요 증가는 웨이퍼 반도체 본딩 애플리케이션 시장 공급업체에게 새로운 기회를 창출하는 주요 요인 중 하나입니다.
시장이 세분화되었습니다. 유형, 응용 프로그램 및 지리를 기반으로 합니다. 유형에 따라 반도체 본딩 시장 규모는 다이 본더, 웨이퍼 본더 및 플립 칩 본더로 분류됩니다. 애플리케이션을 기반으로 반도체 본딩 시장 분석은 RF 장치, MEMS 및 센서, LED, CMOS 이미지 센서 및 3D NAND로 분류됩니다. 지리적으로 반도체 본딩 시장 규모는 주로 북미, 유럽, 아시아 태평양(APAC), 중동 및 아프리카(MEA) 및 남미로 분류됩니다. 2021년에 APAC는 가장 큰 반도체 본딩 시장 점유율을 차지했으며 예측 기간 동안 지배력을 유지할 것으로 예상됩니다. 이 지역은 또한 예측 기간 동안 글로벌 반도체 본딩 시장에서 가장 높은 CAGR을 기록할 것으로 예상됩니다.
Palomar Technologies; 파나소닉 주식회사; Toray 산업 Inc; Kulicke & Soffa 산업, Inc.; 후템; DIAS Automation (HK) Ltd; ASMPT Ltd(구 ASM Pacific Technology Ltd.); EV 그룹; Yamaha Motor Corporation(Yamaha Robotics Holdings); 및 WestBond, Inc.는 몇 가지 주요 반도체 본딩 시장 참여자입니다.
반도체 본딩 시장 참여자들은 진보되고 효율적인 시스템 개발에 중점을 둡니다. 예를 들면 다음과 같습니다.
- 2021년 4월 ASM Pacific Technology는 X-Micro Celeprint의 Transfer Publishing과 ASM AMICRA의 우수한 재현성 다이 본딩 기술을 활용하는 3가지 새로운 생산 공정을 도입하여 초박막의 강도를 다양하게 통합할 수 있도록 했습니다. 최대 300mm 베이스 웨이퍼까지 다이합니다.
- 2021년 9월 Palomar Technologies는 새로운 Palomar 3880-II Die Bonder를 출시했습니다.
Report Coverage
Revenue forecast, Company Analysis, Industry landscape, Growth factors, and Trends
Segment Covered
This text is related
to segments covered.
Regional Scope
North America, Europe, Asia Pacific, Middle East & Africa, South & Central America
Country Scope
This text is related
to country scope.
Frequently Asked Questions
The global semiconductor bonding market was valued at US$ 620.8 Mn in 2021
The key driving factors impacting semiconductor bonding market growth includes:
• Rising Adoption of Stacked Die Technology in IoT Devices
• Growing Number of Product Launches, Partnerships, and Collaborations Related to Semiconductor Bonding Solutions
The key players of semiconductor bonding market are encompassed with Palomar Technologies, Panasonic Corporation, Toray Industries Inc, Kulicke and Soffa Industries, Inc., HUTEM, DIAS Automation (HK) Ltd, ASMPT Ltd (formerly ASM Pacific Technology Ltd.), EV Group, Yamaha Motor Corporation (Yamaha Robotics Holdings), and WestBond, Inc.
APAC is the fastest-growing regional market in the global semiconductor bonding market between 2022-2028.
Canada, France, rest of APAC, South Korea, the UAE, and Brazil are the countries registering high growth rate during the forecast period.
The wafer bonder segment led the global semiconductor bonding market in 2021.
The List of Companies - Semiconductor Bonding Market
- Palomar Technologies
- Panasonic Corporation
- Toray Industries Inc
- Kulicke & Soffa Industries, Inc.
- HUTEM
- DIAS Automation (HK) Ltd
- ASMPT Ltd (formerly ASM Pacific Technology Ltd.)
- EV Group
- Yamaha Motor Corporation (Yamaha Robotics Holdings)
- WestBond, Inc.
The Insight Partners performs research in 4 major stages: Data Collection & Secondary Research, Primary Research, Data Analysis and Data Triangulation & Final Review.
- Data Collection and Secondary Research:
As a market research and consulting firm operating from a decade, we have published and advised several client across the globe. First step for any study will start with an assessment of currently available data and insights from existing reports. Further, historical and current market information is collected from Investor Presentations, Annual Reports, SEC Filings, etc., and other information related to company’s performance and market positioning are gathered from Paid Databases (Factiva, Hoovers, and Reuters) and various other publications available in public domain.
Several associations trade associates, technical forums, institutes, societies and organization are accessed to gain technical as well as market related insights through their publications such as research papers, blogs and press releases related to the studies are referred to get cues about the market. Further, white papers, journals, magazines, and other news articles published in last 3 years are scrutinized and analyzed to understand the current market trends.
- Primary Research:
The primarily interview analysis comprise of data obtained from industry participants interview and answers to survey questions gathered by in-house primary team.
For primary research, interviews are conducted with industry experts/CEOs/Marketing Managers/VPs/Subject Matter Experts from both demand and supply side to get a 360-degree view of the market. The primary team conducts several interviews based on the complexity of the markets to understand the various market trends and dynamics which makes research more credible and precise.
A typical research interview fulfils the following functions:
- Provides first-hand information on the market size, market trends, growth trends, competitive landscape, and outlook
- Validates and strengthens in-house secondary research findings
- Develops the analysis team’s expertise and market understanding
Primary research involves email interactions and telephone interviews for each market, category, segment, and sub-segment across geographies. The participants who typically take part in such a process include, but are not limited to:
- Industry participants: VPs, business development managers, market intelligence managers and national sales managers
- Outside experts: Valuation experts, research analysts and key opinion leaders specializing in the electronics and semiconductor industry.
Below is the breakup of our primary respondents by company, designation, and region:
Once we receive the confirmation from primary research sources or primary respondents, we finalize the base year market estimation and forecast the data as per the macroeconomic and microeconomic factors assessed during data collection.
- Data Analysis:
Once data is validated through both secondary as well as primary respondents, we finalize the market estimations by hypothesis formulation and factor analysis at regional and country level.
- Macro-Economic Factor Analysis:
We analyse macroeconomic indicators such the gross domestic product (GDP), increase in the demand for goods and services across industries, technological advancement, regional economic growth, governmental policies, the influence of COVID-19, PEST analysis, and other aspects. This analysis aids in setting benchmarks for various nations/regions and approximating market splits. Additionally, the general trend of the aforementioned components aid in determining the market's development possibilities.
- Country Level Data:
Various factors that are especially aligned to the country are taken into account to determine the market size for a certain area and country, including the presence of vendors, such as headquarters and offices, the country's GDP, demand patterns, and industry growth. To comprehend the market dynamics for the nation, a number of growth variables, inhibitors, application areas, and current market trends are researched. The aforementioned elements aid in determining the country's overall market's growth potential.
- Company Profile:
The “Table of Contents” is formulated by listing and analyzing more than 25 - 30 companies operating in the market ecosystem across geographies. However, we profile only 10 companies as a standard practice in our syndicate reports. These 10 companies comprise leading, emerging, and regional players. Nonetheless, our analysis is not restricted to the 10 listed companies, we also analyze other companies present in the market to develop a holistic view and understand the prevailing trends. The “Company Profiles” section in the report covers key facts, business description, products & services, financial information, SWOT analysis, and key developments. The financial information presented is extracted from the annual reports and official documents of the publicly listed companies. Upon collecting the information for the sections of respective companies, we verify them via various primary sources and then compile the data in respective company profiles. The company level information helps us in deriving the base number as well as in forecasting the market size.
- Developing Base Number:
Aggregation of sales statistics (2020-2022) and macro-economic factor, and other secondary and primary research insights are utilized to arrive at base number and related market shares for 2022. The data gaps are identified in this step and relevant market data is analyzed, collected from paid primary interviews or databases. On finalizing the base year market size, forecasts are developed on the basis of macro-economic, industry and market growth factors and company level analysis.
- Data Triangulation and Final Review:
The market findings and base year market size calculations are validated from supply as well as demand side. Demand side validations are based on macro-economic factor analysis and benchmarks for respective regions and countries. In case of supply side validations, revenues of major companies are estimated (in case not available) based on industry benchmark, approximate number of employees, product portfolio, and primary interviews revenues are gathered. Further revenue from target product/service segment is assessed to avoid overshooting of market statistics. In case of heavy deviations between supply and demand side values, all thes steps are repeated to achieve synchronization.
We follow an iterative model, wherein we share our research findings with Subject Matter Experts (SME’s) and Key Opinion Leaders (KOLs) until consensus view of the market is not formulated – this model negates any drastic deviation in the opinions of experts. Only validated and universally acceptable research findings are quoted in our reports.
We have important check points that we use to validate our research findings – which we call – data triangulation, where we validate the information, we generate from secondary sources with primary interviews and then we re-validate with our internal data bases and Subject matter experts. This comprehensive model enables us to deliver high quality, reliable data in shortest possible time.
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