Redistribution Layer Material Market 2027 by Types, Application, Technology, Opportunities, End Users and Regions | The Insight Partners

Redistribution Layer Material Market to 2027 - Global Analysis and Forecasts by Application (FOWLP, high bandwidth memory (HBM), Multi-Chip Integration, 2.5D/3D IC Packaging, Package on Package (FOPOP), and TEV); Material (photosensitive polyimides/photo-imageable dielectric, Polyimide (PI), Polybenzoxazole (PBO), and Benzocylobutene (BCB))

Report Code: TIPRE00002904 | No. of Pages: 150 | Category: Electronics and Semiconductor | Status: Upcoming
A redistribution layer (RDL)/ Under Bump Metallization (UBM) is an extra metal layer on a chip that makes the IO pads of an integrated circuit available in other locations. A redistribution layer (RDL) is an extra metal layer on a chip that makes the IO pads of an integrated circuit available in other locations. When an integrated circuit is manufactured, it usually has a set of IO pads that are wire bonded to the pins of the package. A redistribution layer is an extra layer of wiring on the chip that enables you to bond out from different locations on the chip, making chip-to-chip bonding simpler.

Increasing sales of consumer electronic devices are anticipated to be the major factors driving the growing adoptions of redistribution layer material. Higher installations costs hinder the adoptions of redistribution layer material posing a challenge to the growth of the redistribution layer material market. Higher disposable incomes with individuals and the steps taken to improve the electronic designing of the circuits provide new opportunities to the players operating in the redistribution layer material market.

The "Global Redistribution Layer Material Market Analysis to 2027" is a specialized and in-depth study of the redistribution layer material market with a focus on the global market trend. The report aims to provide an overview of the global redistribution layer material market with detailed market segmentation by application, material, and geography. The global redistribution layer material market is expected to witness high growth during the forecast period. The report provides key statistics on the market status of the leading market players and offers key trends and opportunities in the market.

The report provides a detailed overview of the industry including both qualitative and quantitative information. It provides an overview and forecast of the global redistribution layer material market based on the application and material. It also provides market size and forecast till 2027 for overall redistribution layer material market with respect to five major regions, namely; North America, Europe, Asia-Pacific (APAC), and Rest of World (RoW). The redistribution layer material market by each region is later sub-segmented by respective countries and segments. The report covers the analysis and forecast of 18 countries globally along with the current trend and opportunities prevailing in the region.

Besides this, the report analyzes factors affecting market from both demand and supply side and further evaluates market dynamics affecting the market during the forecast period i.e., drivers, restraints, opportunities, and future trend. The report also provides exhaustive PEST analysis for all five regions namely; North America, Europe, APAC, and Rest of World after evaluating political, economic, social and technological factors affecting the Redistribution layer material market in these regions. Further, the report also includes ecosystem analysis for the redistribution layer material market.

Also, key redistribution layer material market players influencing the market are profiled in the study along with their SWOT analysis and market strategies. The report also focuses on leading industry players with information such as company profiles, products, and services offered, financial information for the last 3 years, the key development in the past five years. Some of the key players influencing the market are Amkor Technology, Infineon Technologies, ASE Group, Asahi Kasei, and Merck Group. Also, Dow Chemical Company, Fujifilm Holdings Corporation, Hitachi DuPont MicroSystems, LLC, Toray Industries Inc., and JSR CORPORATION are a few other important players in the redistribution layer material market.
Table of Contents
1. INTRODUCTION
1.1. SCOPE OF THE STUDY
1.2. THE INSIGHT PARTNERS RESEARCH REPORT GUIDANCE
1.3. MARKET SEGMENTATION
- Redistribution Layer Material Market - By Application
- Redistribution Layer Material Market - By Material
- Redistribution Layer Material Market - By Region
o By Country
2. KEY TAKEAWAYS
3. RESEARCH METHODOLOGY
4. REDISTRIBUTION LAYER MATERIAL MARKET LANDSCAPE
4.1. OVERVIEW
4.2. ECOSYSTEM ANALYSIS
4.3. PEST ANALYSIS
4.3.1. North America - PEST Analysis
4.3.2. Europe - PEST Analysis
4.3.3. Asia Pacific (APAC) - PEST Analysis
4.3.4. Rest of World (RoW) - PEST Analysis
5. REDISTRIBUTION LAYER MATERIAL MARKET - KEY INDUSTRY DYNAMICS
5.1. KEY MARKET DRIVERS
5.2. KEY MARKET RESTRAINTS
5.3. KEY MARKET OPPORTUNITIES
5.4. FUTURE TRENDS
5.5. IMPACT ANALYSIS OF DRIVERS AND RESTRAINTS

6. REDISTRIBUTION LAYER MATERIAL MARKET - GLOBAL MARKET ANALYSIS
6.1. REDISTRIBUTION LAYER MATERIAL - GLOBAL MARKET OVERVIEW
6.2. REDISTRIBUTION LAYER MATERIAL - GLOBAL MARKET AND FORECAST TO 2027
6.3. MARKET POSITIONING/ MARKET SHARE
7. REDISTRIBUTION LAYER MATERIAL MARKET REVENUE AND FORECASTS TO 2027 - APPLICATION
7.1. OVERVIEW
7.2. APPLICATION MARKET FORECASTS AND ANALYSIS
7.3. FAN-OUT WAFER LEVEL PACKAGING (FOWLP)
7.3.1. Overview
7.3.2. FOWLP Market Forecast and Analysis
7.4. HIGH BANDWIDTH MEMORY (HBM)
7.4.1. Overview
7.4.2. HBM Market Forecast and Analysis
7.5. MULTI-CHIP INTEGRATION
7.5.1. Overview
7.5.2. Multi-Chip Integration Market Forecast and Analysis
7.6. 2.5D/3D IC PACKAGING
7.6.1. Overview
7.6.2. 2.5D/3D IC Packaging Market Forecast and Analysis
7.7. PACKAGE ON PACKAGE (FOPOP)
7.7.1. Overview
7.7.2. Package on Package (FOPOP) Market Forecast and Analysis
7.8. TEV
7.8.1. Overview
7.8.2. TEV Market Forecast and Analysis
7.9. OTHERS
7.9.1. Overview
7.9.2. Others Market Forecast and Analysis
8. REDISTRIBUTION LAYER MATERIAL MARKET REVENUE AND FORECASTS TO 2027 - MATERIAL
8.1. OVERVIEW
8.2. MATERIAL MARKET FORECASTS AND ANALYSIS
8.3. POLYIMIDE (PI)
8.3.1. Overview
8.3.2. Polyimide Market Forecast and Analysis
8.4. POLYBENZOXAZOLE (PBO)
8.4.1. Overview
8.4.2. Polybenzoxazole Market Forecast and Analysis
8.5. BENZOCYLOBUTENE (BCB)
8.5.1. Overview
8.5.2. Benzocylobutene Market Forecast and Analysis

9. REDISTRIBUTION LAYER MATERIAL MARKET REVENUE AND FORECASTS TO 2027 - GEOGRAPHICAL ANALYSIS
9.1. NORTH AMERICA
9.1.1. North America Redistribution Layer Material Market Overview
9.1.2. North America Redistribution Layer Material Market Forecasts and Analysis
9.1.3. North America Market Forecasts and Analysis - By Application
9.1.4. North America Market Forecasts and Analysis - By Material
9.1.5. North America Market Forecasts and Analysis - By Countries
9.1.5.1. US market
9.1.5.2. Rest of North America market
9.2. EUROPE
9.2.1. Europe Redistribution Layer Material Market Overview
9.2.2. Europe Redistribution Layer Material Market Forecasts and Analysis
9.2.3. Europe Market Forecasts and Analysis - By Application
9.2.4. Europe Market Forecasts and Analysis - By Material
9.2.5. Europe Market Forecasts and Analysis - By Countries
9.2.5.1. France market
9.2.5.2. Germany market
9.2.5.3. Portugal market
9.2.5.4. UK market
9.2.5.5. Rest of Europe market
9.3. ASIA PACIFIC (APAC)
9.3.1. Asia Pacific Redistribution Layer Material Market Overview
9.3.2. Asia Pacific Redistribution Layer Material Market Forecasts and Analysis
9.3.3. Asia Pacific Market Forecasts and Analysis - By Application
9.3.4. Asia Pacific Market Forecasts and Analysis - By Material
9.3.5. Asia Pacific Market Forecasts and Analysis - By Countries
9.3.5.1. South Korea market
9.3.5.2. China market
9.3.5.3. Japan market
9.3.5.4. Taiwan market
9.3.5.5. Rest of APAC market
9.4. REST OF WORLD
9.4.1. Rest of World Redistribution Layer Material Market Overview
9.4.2. Rest of World Redistribution Layer Material Market Forecasts and Analysis
9.4.3. Rest of World Market Forecasts and Analysis - By Application
9.4.4. Rest of World Market Forecasts and Analysis - By Material

10. INDUSTRY LANDSCAPE
10.1. MERGERS & ACQUISITIONS
10.2. MARKET INITIATIVES
10.3. NEW DEVELOPMENTS

11. REDISTRIBUTION LAYER MATERIAL MARKET, KEY COMPANY PROFILES
11.1. AMKOR TECHNOLOGY
11.1.1. Key Facts
11.1.2. Business Description
11.1.3. Applications & Services
11.1.4. Financial Overview
11.1.5. SWOT Analysis
11.1.6. Key Developments
11.2. INFINEON TECHNOLOGIES
11.2.1. Key Facts
11.2.2. Business Description
11.2.3. Applications & Services
11.2.4. Financial Overview
11.2.5. SWOT Analysis
11.2.6. Key Developments
11.3. ASE GROUP
11.3.1. Key Facts
11.3.2. Business Description
11.3.3. Applications & Services
11.3.4. Financial Overview
11.3.5. SWOT Analysis
11.3.6. Key Developments
11.4. ASAHI KASEI
11.4.1. Key Facts
11.4.2. Business Description
11.4.3. Applications & Services
11.4.4. Financial Overview
11.4.5. SWOT Analysis
11.4.6. Key Developments
11.5. MERCK GROUP
11.5.1. Key Facts
11.5.2. Business Description
11.5.3. Applications & Services
11.5.4. Financial Overview
11.5.5. SWOT Analysis
11.5.6. Key Developments
11.6. DOW CHEMICAL COMPANY
11.6.1. Key Facts
11.6.2. Business Description
11.6.3. Applications & Services
11.6.4. Financial Overview
11.6.5. SWOT Analysis
11.6.6. Key Developments
11.7. FUJIFILM HOLDINGS CORPORATION
11.7.1. Key Facts
11.7.2. Business Description
11.7.3. Applications & Services
11.7.4. Financial Overview
11.7.5. SWOT Analysis
11.7.6. Key Developments
11.8. HITACHI DUPONT MICROSYSTEMS, LLC
11.8.1. Key Facts
11.8.2. Business Description
11.8.3. Applications & Services
11.8.4. Financial Overview
11.8.5. SWOT Analysis
11.8.6. Key Developments
11.9. TORAY INDUSTRIES INC.
11.9.1. Key Facts
11.9.2. Business Description
11.9.3. Applications & Services
11.9.4. Financial Overview
11.9.5. SWOT Analysis
11.9.6. Key Developments
11.10. JSR CORPORATION
11.10.1. Key Facts
11.10.2. Business Description
11.10.3. Applications & Services
11.10.4. Financial Overview
11.10.5. SWOT Analysis
11.10.6. Key Developments

12. APPENDIX
12.1. ABOUT THE INSIGHT PARTNERS
12.2. GLOSSARY OF TERMS
The List of Companies

1. Amkor Technology
2. Infineon Technologies
3. ASE Group
4. Asahi Kasei
5. Merck Group
6. Dow Chemical Company
7. Fujifilm Holdings Corporation
8. Hitachi DuPont MicroSystems, LLC
9. Toray Industries Inc.
10. JSR CORPORATION

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