Redistribution Layer Material Market Scope And Analysis

  • Report Code : TIPRE00002904
  • Category : Chemicals and Materials
  • Status : Published
  • No. of Pages : 161
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Redistribution Layer Material Market - Scope 2031

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Redistribution Layer Material Market Report Redistribution Layer Material Market Size and Share Redistribution Layer Material Market Scope and Analysis

Redistribution Layer Material Market Report Scope

Report Attribute Details
Market size in 2022 US$ 192.39 Million
Market Size by 2030 US$ 460.15 Million
Global CAGR (2022 - 2030) 11.5%
Historical Data 2020-2021
Forecast period 2023-2030
Segments Covered By Type
  • Polyimide
  • Polybenzoxazole
  • Benzocylobutene
By Application
  • Fan-Out Wafer Level Packaging
  • 2.5D/3D IC Packaging
Regions and Countries Covered North America
  • US
  • Canada
  • Mexico
Europe
  • UK
  • Germany
  • France
  • Russia
  • Italy
  • Rest of Europe
Asia-Pacific
  • China
  • India
  • Japan
  • Australia
  • Rest of Asia-Pacific
South and Central America
  • Brazil
  • Argentina
  • Rest of South and Central America
Middle East and Africa
  • South Africa
  • Saudi Arabia
  • UAE
  • Rest of Middle East and Africa
Market leaders and key company profiles
  • SK Hynix Inc
  • Samsung Electronics Co Ltd
  • Infineon Technologies AG
  • Dupont De Nemours Inc
  • Fujifilm Holdings Corp
  • Amkor Technology Inc
  • ASE Technology Holding Co Ltd
  • NXP Semiconductors NV
  • JCET Group Co Ltd