Electronic Thermal Management Materials Market Size and Forecasts (2021 - 2031), Global and Regional Share, Trends, and Growth Opportunity Analysis

Coverage: Electronic Thermal Management Materials Market covers analysis by Product (Conductive Pastes, Conductive Tapes, Phase Change Materials, Gap Fillers, Thermal Greases); End-Use Industry (Consumer Electronics, Automotive, Aerospace, Healthcare, Telecommunication) , and Geography (North America, Europe, Asia Pacific, and South and Central America)

  • Report Code : TIPRE00008117
  • Category : Chemicals and Materials
  • No. of Pages : 150
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Electronic Thermal Management Materials Market Size and Forecasts (2021 - 2031), Global and Regional Share, Trends, and Growth Opportunity Analysis

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MARKET INTRODUCTION

Electronic and semiconductor devices generate significant amount of heat. Efficient heat transfer in these devices plays a critical role in the optimum functioning of electronic devices. Electronic thermal management materials are used in the construction of numerous electronic gadgets and devices to keep temperatures within permissible limits and ensure optimum performance and reliability. Advances in nanoelectronics and emergence of novel applications such as flexible electronics and chip stack architectures have created opportunities for new electronic thermal management materials.

MARKET DYNAMICS

Undesired and potentially harmful heat generated by compact electronic components and systems designed with more calculating power has spurred the demand for electronic thermal management materials in recent times. The use of these electronic components and systems in virtually every field including telecommunications, medical, aerospace, defense, industrial etc. is anticipated to create significant demand for electronic thermal management materials used in the construction of electronic systems. As electronic devices are designed with more functionality and compact designs, miniature electronic components tightly packed together need an efficient way of dissipating heat. Niche markets like batteries and LEDs have generated significant demand for electronic thermal management materials with better thermal conductivity, dissipation, and insulation properties. The rise in sales of consumer electronics devices has led to high demand for effective electronic thermal management materials used in the design and construction of a range of electronics devices such as computers, smartphones, tablets, TVs, etc. Electronic thermal management materials such as thermal bonding tapes, gap fillers, heat spreaders, and thermal greases are expected to find wide acceptance in the burgeoning electronic and semiconductor industry during the forecast period.

MARKET SCOPE

The "Global Electronic Thermal Management Materials Market Analysis to 2028" is a specialized and in-depth study of the chemicals and materials industry with a special focus on the global market trend analysis. The report aims to provide an overview of the electronic thermal management materials market with detailed market segmentation by product, end-use industry, and geography. The global electronic thermal management materials market is expected to witness high growth during the forecast period. The report provides key statistics on the market status of the leading electronic thermal management materials market players and offers key trends and opportunities in the market.

MARKET SEGMENTATION

The global electronic thermal management materials market is segmented on the basis of product and end-use industry. On the basis of product, the electronic thermal management materials market is segmented into, conductive pastes, conductive tapes, phase change materials, gap fillers, and thermal greases. On the basis of end-use industry, the market is bifurcated into, consumer electronics, automotive, aerospace, healthcare, and telecommunication.

REGIONAL FRAMEWORK

The report provides a detailed overview of the industry including both qualitative and quantitative information. It provides an overview and forecast of the global electronic thermal management materials market based on various segments. It also provides market size and forecast estimates from the year 2020 to 2028 with respect to five major regions, namely; North America, Europe, Asia-Pacific (APAC), Middle East and Africa (MEA) and South America. The electronic thermal management materials market by each region is later sub-segmented by respective countries and segments. The report covers the analysis and forecast of 18 countries globally along with the current trend and opportunities prevailing in the region.
The report analyzes factors affecting the electronic thermal management materials market from both demand and supply side and further evaluates market dynamics affecting the market during the forecast period i.e., drivers, restraints, opportunities, and future trend. The report also provides exhaustive PEST analysis for all five regions namely; North America, Europe, APAC, MEA, and South America after evaluating political, economic, social and technological factors affecting the electronic thermal management materials market in these regions.

Electronic Thermal Management Materials Market Report Analysis

Electronic Thermal Management Materials Market

  • CAGR (2023 - 2031)
    XX%
  • Market Size 2023
    US$ XX Million
  • Market Size 2031
    US$ XX Million

Report Coverage

  • Market size and forecast at global, regional, and country levels for all the key market segments covered under the scope
  • Key future trends
  • Detailed PEST/Porter’s Five Forces and SWOT analysis
  • Industry landscape and competition analysis & recent developments
  • Detailed company profiles
  • Global and regional market analysis covering key market trends, major players, regulations, and recent market developments

Key Players

  • 3M Company
  • Boyd Corporation
  • Dr. Dietrich Müller GmbH
  • DuPont de Nemours, Inc
  • European Thermodynamics Ltd.
  • Henkel Adhesives Technologies India Private Limited
  • Honeywell International Inc
  • Laird Technologies
  • Parker Hannifin Corp

Regional Overview

  • North America
  • Europe
  • Asia-Pacific
  • South and Central America
  • Middle East and Africa

Market Segmentation

By Product
  • Conductive Pastes
  • Conductive Tapes
  • Phase Change Materials
  • Gap Fillers
  • Thermal Greases
By End-Use Industry
  • Consumer Electronics
  • Automotive
  • Aerospace
  • Healthcare
  • Telecommunication
  • Sample PDF showcases the content structure and the nature of the information with qualitative and quantitative analysis.
MARKET PLAYERS


The reports cover key developments in the electronic thermal management materials market as organic and inorganic growth strategies. Various companies are focusing on organic growth strategies such as product launches, product approvals and others such as patents and events. Inorganic growth strategies activities witnessed in the market were acquisitions, and partnership & collaborations. These activities have paved way for the expansion of business and customer base of market players. The market payers from electronic thermal management materials market are anticipated to lucrative growth opportunities in the future with the rising demand for electronic thermal management materials in the global market. Below mentioned is the list of few companies engaged in the electronic thermal management materials market.
The report also includes the profiles of key companies along with their SWOT analysis and market strategies in the electronic thermal management materials market. In addition, the report focuses on leading industry players with information such as company profiles, components, and services offered, financial information of the last 3 years, the key development in the past five years.

  •  3M Company
  •  Boyd Corporation
  •  Dr. Dietrich Müller GmbH
  •  DuPont de Nemours, Inc
  •  European Thermodynamics Ltd.
  •  Henkel Adhesives Technologies India Private Limited
  •  Honeywell International Inc
  •  Laird Technologies
  •  Parker Hannifin Corp
  •  Wacker Chemie AG

The Insight Partner's dedicated research and analysis team consist of experienced professionals with advanced statistical expertise and offer various customization options in the existing study.

Electronic Thermal Management Materials Market Report Scope

Report Attribute Details
Market size in 2023 US$ XX Million
Market Size by 2031 US$ XX Million
Global CAGR (2023 - 2031) XX%
Historical Data 2021-2022
Forecast period 2024-2031
Segments Covered By Product
  • Conductive Pastes
  • Conductive Tapes
  • Phase Change Materials
  • Gap Fillers
  • Thermal Greases
By End-Use Industry
  • Consumer Electronics
  • Automotive
  • Aerospace
  • Healthcare
  • Telecommunication
Regions and Countries Covered North America
  • US
  • Canada
  • Mexico
Europe
  • UK
  • Germany
  • France
  • Russia
  • Italy
  • Rest of Europe
Asia-Pacific
  • China
  • India
  • Japan
  • Australia
  • Rest of Asia-Pacific
South and Central America
  • Brazil
  • Argentina
  • Rest of South and Central America
Middle East and Africa
  • South Africa
  • Saudi Arabia
  • UAE
  • Rest of Middle East and Africa
Market leaders and key company profiles
  • 3M Company
  • Boyd Corporation
  • Dr. Dietrich Müller GmbH
  • DuPont de Nemours, Inc
  • European Thermodynamics Ltd.
  • Henkel Adhesives Technologies India Private Limited
  • Honeywell International Inc
  • Laird Technologies
  • Parker Hannifin Corp
    • Sample PDF showcases the content structure and the nature of the information with qualitative and quantitative analysis.
    Report Coverage
    Report Coverage

    Revenue forecast, Company Analysis, Industry landscape, Growth factors, and Trends

    Segment Covered
    Segment Covered

    This text is related
    to segments covered.

    Regional Scope
    Regional Scope

    North America, Europe, Asia Pacific, Middle East & Africa, South & Central America

    Country Scope
    Country Scope

    This text is related
    to country scope.

    The List of Companies

    1. 3M Company
    2. Boyd Corporation
    3. Dr. Dietrich Müller GmbH
    4. DuPont de Nemours, Inc
    5. European Thermodynamics Ltd.
    6. Henkel Adhesives Technologies India Private Limited
    7. Honeywell International Inc
    8. Laird Technologies
    9. Parker Hannifin Corp
    10. Wacker Chemie AG

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